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UPS760E3 Datasheet, PDF (1/5 Pages) Microsemi Corporation – 7 A Schottky Barrier Rectifier | |||
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UPS760e3
7 A Schottky Barrier Rectifier
DESCRIPTION
This UPS760e3 in the Powermite3® package is a high efficiency Schottky
rectifier that is also RoHS compliant offering high current/power capabilities
previously found only in much larger packages. They are ideal for SMD
applications that operate at high frequencies. In addition to its size
advantages, the Powermite3® package includes a full metallic bottom that
eliminates the possibility of solder flux entrapment during assembly and a
unique locking tab. This acts as an efficient heat path to the heat-sink
mounting. Its innovative design makes this device ideal for use with
automatic insertion equipment.
IMPORTANT: Forthemostcurrentdata,consultMICROSEMIâs website: http://www.microsemi.com
ABSOLUTE MAXIMUM RATINGS AT 25º C
(UNLESS OTHERWISE SPECIFIED)
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
VRRM
Working Peak Reverse Voltage
VRWM
60
V
DC Blocking Voltage
VR
RMS Reverse Voltage
VR(RMS)
42
V
Average Rectified Output Current
Io
7
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine wave Superimposed
IFSM
100
A
on Rated Load@ Tc =90 ºC
Storage Temperature
TSTG
-55 to +150
ºC
Junction Temperature
TJ
-55 to +125
ºC
THERMAL CHARACTERISTICS
(UNLESS OTHERWISE SPECIFIED)
Thermal Resistance
Junction to Case (Bottom)
RθJC
2.5
ºC/Watt
Junction to Ambient (1)
RθJA
65
ºC/Watt
(1) When mounted on FR-4 PC board using 2 oz copper with recommended minimum foot print.
KEY FEATURES
 Very low thermal resistance package
 RoHS Compliant with e3 suffix part number
 Guard-ring-die construction for transient
protection
 Efficient heat path with Integral locking
bottom metal tab
 Low forward voltage
 Full metallic bottom eliminates flux
entrapment
 Compatible with automatic insertion
 Low profile-maximum height of 1mm
APPLICATIONS/BENEFITS
 Switching and Regulating Power Supplies
 Silicon Schottky (hot carrier) rectifier for
minimal reverse voltage recovery
 Elimination of reverse-recovery oscillations
to reduce need for EMI filtering
 Charge Pump Circuits
 Reduces reverse recovery loss with low IRM
 Small foot print
190 X 270 mils (1:1 Actual size)
See mounting pad details on pg 3
MECHANICAL & PACKAGING
⢠CASE: Void-free transfer molded
thermosetting epoxy compound meeting
UL94V-0
⢠FINISH: Annealed matte-Tin plating over
copper and readily solderable per MIL-
STD-750 method 2026 (consult factory for
Tin-Lead plating)
⢠POLARITY: See figure (left)
⢠MARKING: S760â¢
⢠WEIGHT: 0.072 gram (approx.)
⢠Package dimension on last page
⢠Tape & Reel option: 16 mm tape per
Standard EIA-481-B, 5000 on 13â reel
Copyright © 2007
10-15-2007 Rev B
Microsemi
Page 1
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