UMA5817 Datasheet, PDF (1/3 Pages) Microsemi Corporation – ULTRAMITTE SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS

SCOTTSDALE DIVISION
UMA5817, UMA5818, and UMA5819
ULTRAMITE™ SURFACE MOUNT
SCHOTTKY BARRIER RECTIFIERS
DESCRIPTION
The UMA5817 thru UMA5819 UltraMite™ series offers small efficient
surface mount packaging with the same electrical features as the popular
1N5817, 1N5818, and 1N5819 Schottky rectifiers. It provides the same
size footprint as other small surface mount DO-214AC or BA package
options except with a much lower profile height. Its configuration in a “2010
MELF” style robust package design prevents lead damage to terminals and
also minimizes parasitics by eliminating internal wire bonds and providing
very short internal conduction paths.
APPEARANCE
UltraMite™
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
• Plastic package has Underwriters Laboratory
Flammability classification 94V-0
• Metal to silicon rectifier, majority carrier conduction
• High current capability, low V_F
• Built-in stress relief with similar COE as PC boards
• Optional Lead-Free design/finish (UMAF5817-19)
• Options for screening in accordance with MIL-PRF-
19500/586 for JAN, JANTX, JANTXV, and JANS
are available by adding MQ, MX, MV, or MSP
prefixes respectively to part numbers. For
example, designate a MXUMAJ5819 for a JANTX
screen.
• For surface mount applications
• For use in low-voltage high-frequency switching
power supplies, inverters, free wheeling, and
polarity protection applications
• Low power loss, High efficiency
• Low inductive parasitics for minimal Ldi/dt effects
• Fits same small PCB footprints as popular
“SMAJxxx” or “SMBJxxx” Schottky devices in
JEDEC outlines DO-214AC (or BA) and DO-214AA
respectively except with much lower height profile
• Robust 2010 MELF style package configuration for
pick-and-place handling
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
• Operating junction and storage temperature
range (T_J and T_STG): -50 ^oC to +125^oC
• Forward average rectified current (I_O)
@T_C=75^oC: 1.0 Amp
• Forward surge current (I_FSM) 8.3 ms single
half-sine waveform superimposed on rated
load (JEDEC Method): 25 Amps
• Typical thermal resistance (R_θJL): 50 ^oC/W
• Typical junction capacitance (C_J) at 1.0 MHz
and V_R of 5.0 Volts: 65 pF for UMA5817, and
46 pF for UMA5818 and UMA5819
• Solder temperatures: 260 ^ºC for 10 s (maximum)
• FRP substrate material and epoxy under-fill
package meeting UL94V-0
• Terminals solder plated (solderable per MIL-STD-
750, Method 2026)
• Body marked with 5817, 5818, or 5819
• Cathode designated with band
• Weight: 0.020 grams
• Tape & Reel packaging per EIA-481-2 with 12 mm
tape and 3000 units/reel (7 inch reel) or 10,000
units/reel (13 inch reel)
• See package dimensions on last page
ELECTRICAL CHARACTERISTICS @ 25^oC unless specified otherwise
Working Maximum Maximum
Maximum
Peak
RMS
Peak
Forward
Reverse Voltage; Repetitive Voltage at 1.0A
Voltage
Voltage;
(note 1)
Part
V_RWM
Number Volts
V_RMS
Volts
V_RRM
Volts
V_F
Volts
UMA5817 20
14
20
0.45
UMA5818 30
21
30
0.55
UMA5819 40
28
40
0.60
NOTES: (1) Pulse test with P_W=300 µsec, 1% duty cycle.
Maximum
Forward
Voltage at 3.0A
(note 1)
V_F
Volts
0.75
0.875
0.90
Maximum
dc reverse
current @
V_RWM
I_R
mA
0.5
0.5
0.5
Copyright  2002
10-16-03 REV B
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
Maximum dc
reverse
current @
V_RWM ,100^oC
I_R
mA
10
10
10
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