TVSF1206 Datasheet, PDF (1/6 Pages) Microsemi Corporation – “FemtoFarad Polymer ESD Suppressor

TRANSIENT PROTECTION PRODUCTS
TVSF1206
“FemtoFarad Polymer ESD Suppressor
PRODUCT PREVIEW
DESCRIPTION
The “FemtoFarad” product family is
specifically designed to protect sensitive
electronic circuits from the threat of
electrostatic discharge (ESD).
“FemtoFarad” products react almost
instantly to the transient voltage and
effectively clamp it below 60 V,
meaning less voltage stress during the
clamp period and greater IC protection.
The design of “FemtoFarad” products
inherently produces a low capacitance
part. In the off-state “FemtoFarad” is
virtually invisible to the circuit. Installed
from signal line to ground, the
“FemtoFarad” device exhibits a high
impedance and low capacitance that
makes it transparent to high-speed
digital circuits. Signals are not distorted
or disrupted.
With “FemtoFarad” devices,
waveform definition stays true and high-
speed signals do not suffer.
“FemtoFarad” products utilize a unique
polymer-based material. The nature of
the material creates a bi-directional part,
which means that only one device is
required to provide complete ESD
protection regardless of the surge
polarity. The combination of this material
with proven thick film on ceramic
technology produces a reliable, surface
mount product that will help protect
mobile communications, computers, data
processing, test equipment, and many
other electronic applications from EDS.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
KEY FEATURES
!"Exceeds testing
requirements outlined in IEC
61000-4-2
!"Extremely low capacitance
!"Very low leakage current
!"Fast response time
!"Bi-directional
!"Surface mount
!"Nickel & Tin/Lead plated
APPLICATIONS/BENEFITS
!"GaAs & InGaAs
Photodetector protection
!"InGaP HBT Power Amplifier
Protection
!"High Speed Data Line
Protection
!"Mobile Phone ESD
protection
Part Ratings and Characteristics
Performance Characteristics
Min
Typ
Max
Continuous operating voltage
-
Clamping voltage ¹
-
Trigger voltage ²
-
ESD voltage capability ⁴
-
-
6
35
60
150
300
8
15
Capacitance (@ 1 MHz)
-
0.25
1
Leakage current (@ 6 VDC)
-
<10
<100
Peak current ^{1, 4}
-
30
45
Operating temperature
ESD pulse withstand ^1,3
-40
+25
+85
20
-
-
Units
VDC
V
V
kV
pF
nA
A
°C
# pulses
Notes:
1. Per IEC 1000-4-2, 30A @ 8kV, level
4, clamping measurements made 30 ns
after initiation of pulse, all tests in
contact discharge mode.
2. Trigger measurement made using
TLP method (see page5).
3. Parts will remain within the
specifications listed in the above table
after a minimum of 20 ESD pulses.
4. TVSF1206 devices are capable of
with-standing up to a 15 kV, 45 A ESD
pulse. Device ratings are given at 8 kV
per Note 1 unless otherwise specified.
Environmental Specifications;
• Humidity, steady state: MIL-STD-202F, Method 103B, 90-95% RH, 40°C, 96 hrs.
• Thermal shock: MIL-STD-202, Method 107G, -65°C to 125°C, 30 min. cycle 5 cycles
• Vibration: MIL_STD-202F, Method 201A, (10 to 55 to 10 Hz, 1 min. cycle, 2 hrs each in X-Y-Z)
• Chemical resistance: ASTM D-543, 24 hrs @ 50°C, 3 solutions (H₂0, detergent solution, defluxer)
• Full Load voltage: 24 VDC, 1000 hrs, 25°C
• Solder leach resistance and terminal adhesion: Per EIA-576
• Solderability: MIL-STD-202, Method 208 (95% coverage)
Copyright  2000
MSC1591.PDF 2000-09-20
Microsemi
Scottsdale Division
8700 E. Thomas Road, Scottsdale, AZ. 85251, 480-940-6300, Fax: [phone]
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