SMBJ4742 Datasheet, PDF (1/3 Pages) Microsemi Corporation – SILICON 2.0 Watt ZENER DIODES

SCOTTSDALE DIVISION
SMBG4728 thru SMBG4764A
SMBJ4728 thru SMBJ4764A
SILICON 2.0 Watt ZENER DIODES
DESCRIPTION
The SMBJ4728A-4764A and SMBG4728A-4764A series of surface mount
2.0 watt Zeners provides voltage regulation in a selection from 3.3 to 100
volts with different tolerances as identified by suffix letter on the part
number. This surface mount product series with lower thermal resistance
features is equivalent to the JEDEC registered 1N4728 thru 1N4764A
with identical electrical characteristics except it is rated at 2.0 W instead
of 1.0 W. It is available in J-bend design (SMBJ) with the DO-214AA
package for greater PC board mounting density or in Gull-wing design
(SMBG) in the DO-215AA for visible solder connections. Microsemi also
offers numerous other Zener products to meet higher and lower power
applications.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
APPEARANCE
NOTE: All SMB series are equivalent
to prior SMS package identifications.
FEATURES
• Surface mount equivalent to 1N4728 to 1N4764A
• Ideal for high-density and low-profile mounting
• Zener voltage available 3.3V to 200V
• Standard voltage tolerances are plus/minus 5% with
A suffix and 10 % with no suffix identification
• Tight tolerances available in plus or minus 2% or
1% with C or D suffix respectively
• Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
APPLICATIONS / BENEFITS
• Regulates voltage over a broad operating current
and temperature range
• Wide selection from 3.3 to 100 V
• Popular DO-214AA or DO-215AA packages and
footprints for either high density J-bend or Gull-wing
designs for visible solder joints
• Nonsensitive to ESD per MIL-STD-750 Method
1020
• Moisture classification: Level 1 per IPC/JEDEC J-
STD-020B with no dry pack required
MAXIMUM RATINGS
• Power dissipation at 25^ºC: 2.0 watts (also see
derating in Figure 1).
• Operating and Storage temperature: -65^ºC to
+150^ºC
• Thermal Resistance: 35 ^ºC/W junction to lead, or
100^ºC/W junction to ambient when mounted on FR4
PC board (1oz Cu) with recommended footprint
(see last page)
• Steady-State Power: 2 watts at T_L < 80^oC, or 1.25
watts at T_A = 25^ºC when mounted on FR4 PC board
with recommended footprint (also see Figure 1)
• Forward voltage @200 mA: 1.2 volts (maximum)
• Solder Temperatures: 260 ^ºC for 10 s (maximum)
MECHANICAL AND PACKAGING
• CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
• TERMINALS: Gull-wing or C-bend (modified J-
bend) leads, tin-lead plated solderable per MIL-STD-
750, method 2026
• POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to opposite end for Zener regulation
• MARKING: Includes part number without prefix
(e.g. 4728A, 4734C, 4764D, etc.)
• TAPE & REEL option: Standard per EIA-481-1-A
with 12 mm tape, 750 per 7 inch reel or 2500 per 13
inch reel (add “TR” suffix to part number)
• WEIGHT: 0.1 grams
• See package dimensions on last page
Copyright  2002
8-21-2003 REV C
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
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