SMAJ4460 Datasheet, PDF (1/2 Pages) Microsemi Corporation – This 1.5 Watt Zener series in a low-profile light-weight plastic surface Mount Configuration

SCOTTSDALE DIVISION
SMAJ4460 thru SMAJ4496
and SMAJ6485 thru SMAJ6491
1.5 Watt Zener Diodes
DESCRIPTION
This 1.5 watt zener series in a low-profile light-weight plastic surface mount
configuration, with stress-relief J-bend contacts, meets or exceeds the electrical
performance of the 1N4460 thru 1N4496 and 1N6485 thru 1N6491. It also provides
double the overall surge performance by using a larger active die element. This
includes ESD protection per IEC61000-4-2, EFT protection per IEC61000-4-4, and
higher surge levels defined herein. The low-flat profile provides easier insertion or
automatic handling compared to other MELF style packages. Its thermally efficient
design lowers junction temperatures and extends operating temperature range
before derating begins. Power derates to zero at 150°C for these plastic packages.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
SURFACE MOUNT
ZENER
DO-214BA or AC
(SMAJ)
FEATURES
• Zener voltages: 3.3 volts to 200 volts
• Metallurgically bonded
• Reliability data per JESD22-A108, JESD22-A104,
JESD22-A113-B, JESD22-A101-B, and JESD22-A102
• Thermally efficient surface mount with J-bends for
stress relief (flat handling surface for easier placement)
• Options for screening in accordance with MIL-PRF-
19500/406 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers. For example, designate a
MXSMAJ4460 for a JANTX screen.
MAXIMUM RATINGS
• Operating temperature: -55°C to +150°C
• Storage temperature: -55°C to +150°C
• 1.5 watt steady-state maximum power
• Thermal resistance, R?JL = 15 °C/W
APPLICATIONS / BENEFITS
• For high reliability voltage regulation in low profile
surface mount locations requiring easy
placement and strain relief
• Light weight for airborne or satellite applications
• Superior surge quality to protect from ESD and
EFT transients per IEC61000-4-2 and -4-4 and
higher surge levels defined herein
MECHANICAL AND PACKAGING
• Molded epoxy package meets UL94V-0
• Terminals: solderable per MIL-STD-750
Method 2026. (max 260 °C for 10 sec.)
• Body marked with P/N without SMAJ letters
(ie. 4460, 4496, 6485, 4460, etc.)
• Polarity is indicated by cathode band
• Weight: 0.064 grams (approximate)
• Tape & Reel packaging per EIA-481-2 with 12
mm tape and 2500 units per reel (13 inch reel)
POWER DERATING – OUTLINE – MOUNTING PAD
DIMENSIONS
DIM
INCHES
MILLIMETERS
MIN MAX MIN MAX
A
.052
.103 1.32 2.62
B
.160
.180 4.06 4.57
C
.100
.110 2.54 2.79
D
.194
.216 4.93 5.49
E
.078
.115 1.98 2.92
F
.030
.060
0.76
1.52
G
--
.005
--
0.13
DIMENSION A IS WITHIN DO-214BA BUT HIGHER THAN
STANDARD JEDEC OUTLINES..DIMENSION B IS WIDER
THAN BOTH JEDEC OUTLINES FOR LOWER THERMAL
RESISTANCE
Outline
Mounting Pad
Copyright © 2001
MSCXXXX.PDF 4-07-03 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
Page 1