SM0502 Datasheet, PDF (1/2 Pages) Microsemi Corporation – CERAMIC MELF PIN DIODES

CERAMIC MELF PIN DIODES
• Magnetic/Non-Magnetic“Cer-Met”
(MELF) Packages
• Very Low Inductance, Full Faced
Bonding
• Hermetic, Low Loss and Low Distortion
Applications
• High Volume Manufacturing Capability
• 100% TX Screening Available
DESCRIPTION
This new line of ‘MELF’ high power PIN diodes are
hermetically sealed surface mount packaged devices
with full face bonded chips for low inductance
construction. The MELF ceramic package has square
end terminations which are ideal for surface mount and
pick and place operations. The PIN diode chips are
coated with a special hard glass passivation which is
required for high power applications to enhance the
reliability resulting in MTBF’s of greater than one million
hours.
Control Devices
APPLICATIONS
These MELF diodes are used as switching, attenuating
and phase shifting elements from HF through 2 GHz
and have breakdown voltage ratings up to 700 volts.
Non-magnetic “Cer-Met” (MELF’s) are also used as
switching elements in MRI (magnetic resonance
imaging) applications. Conventional magnetic MELF
packages are used in cellular, beam steering
applications, filter switch banks, and antenna tuning
units..
Microsemi – Lowell
75 Technology Drive, Lowell, MA 01851 Tel. [phone]