English
Language : 

SK33A-TP Datasheet, PDF (1/4 Pages) Microsemi Corporation – Same Electrical Characteristics As The SMC Version
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
Features
• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
• Same Electrical Characteristics As The SMC Version
• Very Low Cost
• Can Be Up To 50% Smaller Than The SMC To Save Precious
Board Space
• High Current Capability With Low Forward Voltage
• For Surface Mount Applications
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
• Halogen free available upon request by adding suffix "-HF"
Maximum Ratings
• Operating Temperature: -50°C to +125°C
• Storage Temperature: -50°C to +150°C
• Maximum Thermal Resistance; 10°C/W Junction To Lead
MCC
Part
Number
SK32A
SK33A
SK34A
SK35A
SK36A
SK38A
SK310A
Device
Marking
SK32A
SK33A
SK34A
SK35A
SK36A
SK38A
SK310A
Maximum
Recurrent
Peak Reverse
Voltage
20V
30V
40V
50V
60V
80V
100V
Maximum
RMS
Voltage
14V
21V
28V
35V
42V
56V
70V
Maximum
DC
Blocking
Voltage
20V
30V
40V
50V
60V
80V
100V
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
Current
IF(AV)
3.0A TL = 100°C
Peak Forward Surge
IFSM
Current
80A 8.3ms, half sine
Maximum
Instantaneous
Forward Voltage
SK32A-34A
VF
SK35A-36A
SK38A-310A
.50V
.75V
.85V
IFM = 3.0A;
TJ = 25°C*
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
IR
.5mA TJ = 25°C
20mA TJ = 100°C
Typical Junction
Capacitance
CJ
250pF Measured at
1.0MHz, VR=4.0V
*Pulse test: Pulse width 200 µsec, Duty cycle 2%
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
SK32A
THRU
SK310A
3 Amp Schottky
Rectifier
20 to 100 Volts
DO-214AC
(HSMA) (High Profile)
H
Cathode Band
J
A
C
E
D
F
G
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.078
.116
B
.067
.089
C
.002
.008
D
---
.02
E
.035
.055
F
.065
.096
G
.205
.224
H
.160
.180
J
.100
.112
MM
MIN
1.98
1.70
.05
---
.89
1.65
5.21
4.06
2.57
B
MAX
2.95
2.25
.20
.51
1.40
2.45
5.69
4.57
2.84
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090”
0.085”
0.070”
Revision: C
www.mccsemi.com
1 of 4
2013/01/01