MXP1018-C Datasheet, PDF (1/1 Pages) Microsemi Corporation – Photo SCR Chip

2830 S. Fairview St.
Santa Ana, CA 92704
PH: 714.979.8220
FAX: [phone]
Photo SCR Chip
Features
• Light Activated Photo SCR
• Planar PNPN
• High Voltage
• Cathode and Gate pads are Aluminum Wire bondable
• Anode is backside of die
• Backside metallization - Gold
• Die Attach methods: eutectic or epoxy
MXP1018-C
Electrical Characteristics @ 25^oC
SYMBOL
CHARACTERISTIC
V_DM
Off-State Voltage
V_RM
Reverse Voltage
I_DM
Off-State Leakage Current
I_RM
Reverse Leakage
I_GT
Gate Trigger Current
I_H
Holding Current
t_ON
Turn-On Time
CONDITIONS
MIN
TYP
MAX
UNITS
660
Volts
550
Volts
0.2
µ Amps
0.5
µ Amps
1.3
µ Amps
40
µ Amps
5
µseconds
Data Sheet # MSC1330.PDF
Updated:October 1998
Opto Products