MLL14KESD5.0 Datasheet, PDF (1/4 Pages) Microsemi Corporation – SURFACE MOUNT TVS

SCOTTSDALE DIVISION
MLL14KESD5.0 thru MLL14KESD170A
SURFACE MOUNT TVS
DESCRIPTION
These surface mount Transient Voltage Suppressor (TVS) devices feature
the ability to clamp dangerous high voltage short-term transients such as
produced by direct or radiated electro-static discharge phenomena before
entering sensitive component regions of a circuit design. They are small
economical TVSs targeted primarily for short term transients below a few
microseconds while still achieving significant peak-pulse-power capability
as seen in Figure 1.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
APPEARANCE
DO-213AB
FEATURES
• Excellent protection in clamping direct ESD level
transients in excess of 40,000 V per MIL-STD-750,
Method 1020 (approx. 150 ns exponential wave)
• Absorbs ESD level transients of 14,000 Watts per
MIL-STD-750, Method 1020 (approximately 150 ns
exponential wave, or one microsecond transients
up to 4000 watts. See Figure #1 and #2 for overall
transient Peak Pulse Power.
• Clamps Transients in less than 100 picoseconds
• Working Stand-off Voltage range of 5V to 170V
• Hermetic DO-213AB package. Also available in
axial-leaded DO-41package (see separate data
sheet for 14KESD5.0 series)
APPLICATIONS / BENEFITS
• Protects Sensitive circuits from short duration fast
rise time transients such as Electrostatic Discharge
(ESD) or Electrical Fast Transients (EFT)
• Minimal capacitance (See Figure #3)
• Small surface-mount footprint for high density
mounting
• Bidirectional features available by adding a “C” or
“CA” suffix to part number
MAXIMUM RATINGS
• 4000 Watts for One Microsecond Square Wave or
14,000 watts per ESD Wave form of MIL-STD-750,
method 1020.
• See Surge Rating curve in Figures #1 and 2.
• Operating and storage temperature –65^oC to 175^oC
• Thermal Resistance: 40 ^ºC/W junction to end cap, or
120^ºC/W junction to ambient when mounted on FR4
PC board (1 oz Cu) with recommended footprint (see
last page)
• Steady-State Power: 1.50 watts at T_EC < 115^oC, or
1.25 watts at T_A = 25^ºC when mounted on FR4 PC
board and recommended footprint as described for
thermal resistance (also see Figure 1)
• Derate at 22.8 W/^oC above 25^oC for P_PP (1µs) and at
15 mW/^oC above 75^oC for dc power.
• Forward Surge Current 500 amps for 1µs at T_L =
25^oC (rise time > 100 ns).
MECHANICAL AND PACKAGING
• CASE: Hermetically sealed DO-213AB glass MELF
package
• TERMINALS: End caps, tin-lead plated solderable
per MIL-STD-750, method 2026
• POLARITY: Cathode indicated by band.
• MARKING: Cathode band only
• TAPE & REEL optional: Standard per EIA-481-B
with 12 mm tape, 1500 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
• WEIGHT: 0.05 grams
• See package dimensions on last page
Copyright  2002
10-03-2003 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
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