MC5610_04 Datasheet, PDF (1/2 Pages) Microsemi Corporation – FAST RECOVERY HIGH POWER MICRO HIGH VOLTAGE RECTIFIERS

SCOTTSDALE DIVISION
MC5610 thru MC5619
FAST RECOVERY, HIGH POWER,
MICRO, HIGH VOLTAGE RECTIFIERS
DESCRIPTION
The MC5610 through MC5619 series of fast recovery high voltage silicon
rectifiers feature the smallest packages available. They are ideal for high-
reliability where a failure cannot be tolerated. These 0.275 to 0.790 Amp
rated rectifiers for working peak reverse voltages from 1500 to 5000 volts are
hermetically sealed with voidless-glass construction using an internal
“Category I” metallurgical bond. Typical applications include transmitters,
power supplies, radar equipment and X-ray machines. Surface mount MELF
package configurations are also available by adding “SM” suffix. Microsemi
also offers numerous other rectifier products to meet higher and lower
current ratings with various recovery time speed requirements including fast
and ultrafast device types in both through-hole and surface mount packages.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
APPEARANCE
S Package
FEATURES
• Voidless Hermetically Sealed Glass Package
• Triple-Layer Passivation
• Internal “Category I” Metallurgical bonds
• Lowest Reverse Leakage Available
• Lowest Thermal Resistance Available
• Absolute High Voltage / High Temperature Stability
• Surface mount equivalents also available in a square
end-cap MELF configuration with “SM” suffix
APPLICATIONS / BENEFITS
• High voltage fast recovery rectifiers 1500 to 5000 V
• Military and other high-reliability applications
• Applications include bridges, half-bridges, catch
diodes, voltage multipliers, X-ray machines, power
supplies, transmitters, and radar equipment
• High forward surge current capability
• Extremely robust construction
• Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
• Operating Temperature Range:
MC5610 – MC5612……-55^oC to 150^oC
MC5613 – MC5616……-65^oC to 150^oC
MC5617 – MC5619……-65^oC to 125^oC
• Storage Temperature Range: -65^oC to 175^oC
• Thermal Resistance: 38^oC/W junction to lead at 3/8
inch (10 mm) lead length from body
• Average Rectified Forward Current (I_O): See
Electrical Characteristics for maximum rating at 55^oC
and 100^oC. Also see typical linear derating in Fig 1.
• Forward Surge Current: See Electrical
Characteristics for surge at 8.3 ms half-sine wave
• Solder Temperatures: 260ºC for 10 s (maximum)
MECHANICAL AND PACKAGING
• CASE: Hermetically sealed voidless hard glass with
Tungsten slugs
• TERMINATIONS: Axial leads are copper with
Tin/Lead (Sn/Pb) finish
• MARKING: Body paint and part number, etc.
• POLARITY: Cathode band
• TAPE & REEL option: Standard per EIA-296
• WEIGHT: 400 mg (approx)
• See package dimensions on last page
Copyright  2004
12-29 2004 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
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