MAD1106_05 Datasheet, PDF (1/2 Pages) Microsemi Corporation – Switching Diode Array Steering Diode TVS ArrayTM

SCOTTSDALE DIVISION
MAD1106 and MAD1106e3
Switching Diode Array
Steering Diode TVS Array™
DESCRIPTION
APPEARANCE
These low capacitance diode arrays are multiple, discrete, isolated
junctions fabricated by a planar process and mounted in a 14-pin package
for use as steering diodes protecting up to eight I/O ports from negative
ESD, EFT, or surge by directing them to ground (pin 14)*. They may also
be used in fast switching core-driver applications. This includes computers
and peripheral equipment such as magnetic cores, thin-film memories,
plated-wire memories, etc., as well as decoding or encoding applications.
These arrays offer many advantages of integrated circuits such as high-
density packaging and improved reliability. This is a result of fewer pick
and place operations, smaller footprint, smaller weight, and elimination of
various discrete packages that may not be as user friendly in PC board
mounting. They are available with either Tin-Lead plating terminations or
as RoHS Compliant with annealed matte-Tin finish by adding an “e3” suffix
to the part number.
*See MMAD1105(e3) for directing positive transients to positive side of
the power supply line.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
Top Viewing Pin Layout
FEATURES
APPLICATIONS / BENEFITS
• 8 Diode Array
• Molded 14-Pin Dual-In-Line Package
• UL 94V-0 Flammability Classification
• Low Capacitance 1.5 pF per diode
• Switching speeds less than 5 ns
• RoHS Compliant devices available by adding “e3” suffix
• IEC 61000-4 compatible
61000-4-2 (ESD): Air 15kV, contact – 8 kV
61000-4-4 (EFT): 40A – 5/50 ns
61000-4-5 (surge): 12A, 8/20 µs
• Low capacitance steering diode protection for high
frequency data lines
• RS-232 & RS-422 Interface Networks
• Ethernet: 10 Base T
• Computer I / O Ports
• LAN
• Switching Core Drivers
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Forward Surge Current: 2 Amps (8.3 ms)
12 Amps (8/20 µs)
• Continuous Forward Current: 400 mA (one diode)
• Power Dissipation (P_D): 1500 mW (total)
• Solder temperatures: 260°C for 10 s (maximum)
• CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0 flammability
classification
• TERMINALS: Tin-Lead or RoHS Compliant
annealed matte-Tin plating solderable per MIL-STD-
750 method 2026
• MARKING: MSC logo, MAD1106 or MAD1106e3 and
date code. Pin #1 is to the left of the dot or indent on
top of package.
• WEIGHT: 0.997 grams (approximate)
• Carrier tubes: 25 pcs (Standard)
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless otherwise specified
PART
NUMBER
BREAKDOWN
VOLTAGE
V_BR
@ I_BR =100µA
V
WORKING
PEAK
REVERSE
VOLTAGE
V_RWM
V
LEAKAGE
CURRENT
I_R
T_A = 25°C
µA
LEAKAGE
CURRENT
I_R
T_A = 150°C
µA
CAPACITANCE
C
@0V
pF
REVERSE
RECOVERY
TIME
t_rr
ns
FORWARD
VOLTAGE
V_F
I_F = 10 mA
V
MIN
MAX
MAX
@V_R
MAX
@V_R
TYP
MAX
MAX
MAD1106
MAD1106e3
90
75
0.200
20
300
20
1.5
5.0
1.00
Copyright © 2005
6-28-2005 REV L
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
FORWARD
VOLTAGE
V_F
I_F = 100 mA
V
MAX
1.20
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