MAD1103_05 Datasheet, PDF (1/2 Pages) Microsemi Corporation – Switching Diode Array Steering Diode TVS ArrayTM

SCOTTSDALE DIVISION
MAD1103 and MAD1103e3
Switching Diode Array
Steering Diode TVS Array^TM
DESCRIPTION
These low capacitance diode arrays are multiple, discrete, isolated
junctions fabricated by a planar process and mounted in a 14-PIN package
for use as steering diodes protecting up to eight I/O ports from ESD, EFT,
or surge by directing them either to the positive side of the power supply
line or to ground (see figure 1). An external TVS diode may be added
between the positive supply line and ground to prevent overvoltage on the
supply rail. They may also be used in fast switching core-driver
applications. This includes computers and peripheral equipment such as
magnetic cores, thin-film memories, plated-wire memories, etc., as well as
decoding or encoding applications. These arrays offer many advantages of
integrated circuits such as high-density packaging and improved reliability.
This is a result of fewer pick and place operations, smaller footprint, smaller
weight, and elimination of various discrete packages that may not be as
user friendly in PC board mounting. They are available with either Tin-Lead
plating terminations or as RoHS Compliant with annealed matte-Tin finish
by adding an “e3“ suffix to the part number.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
APPEARANCE
Top Viewing Pin Layout
FEATURES
• 16 Diode Array / protects 8 lines
• Molded 14-Pin Dual-In-Line Package
• Low Capacitance 1.5 pF per diode
• Switching speeds less than 5 ns
• RoHS compliant devices available by adding “e3” suffix
• IEC 61000-4 compatible
61000-4-2 (ESD): Air 15 kV, contact 8 kV
61000-4-4 (EFT): 40 A, 5/50 ns
61000-4-5 (surge): 12 A, 8/20 µs
APPLICATIONS / BENEFITS
• Low capacitance steering diode protection for high
frequency data lines
• RS-232 & RS-422 Interface Networks
• Ethernet: 10 Base T
• Computer I / O Ports
• LAN
• Switching Core Drivers
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Forward Surge Current: 2 Amps (8.3 ms)
12 Amps (8/20 µs)
• Continuous Forward Current: 400 mA (one diode)
• Power Dissipation (P_D): 1500 mW (total)
• Solder temperatures: 260°C for 10 s (maximum)
• CASE: Void-free transfer molded thermosetting epoxy
body meeting UL94V-0 flammability classification
• TERMINALS: Tin-Lead or RoHS Compliant annealed
matte-Tin plating solderable per MIL-STD-750 method
2026
• MARKING: MSC logo, MAD1103 or MAD1103e3 and
date code. Pin #1 is to the left of the dot or indent on
top of package.
• WEIGHT: 0.997 grams (approximate)
• Carrier tubes: 25 pcs (Standard)
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless otherwise specified
PART
NUMBER
BREAKDOWN
VOLTAGE
V_BR
@ I_BR =100µA
V
WORKING
PEAK
REVERSE
VOLTAGE
V_RWM
V
LEAKAGE
CURRENT
I_R
T_A = 25°C
µA
LEAKAGE
CURRENT
I_R
T_A = 150°C
µA
CAPACITANCE
C
@0V
pF
REVERSE
RECOVERY
TIME
t_rr
ns
FORWARD
VOLTAGE
V_F
I_F = 10 mA
V
FORWARD
VOLTAGE
V_F
I_F = 100 mA
V
MIN
MAD1103
MAD1103e3
90
MAX
75
MAX
0.200
@V_R
20
MAX
300
@V_R
20
TYP
1.5
MAX
5.0
MAX
1.00
MAX
1.20
Copyright © 2005
6-28-2005 REV N
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
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