LX5543 Datasheet, PDF (1/3 Pages) Microsemi Corporation – 2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier and SP3T Switch

LX5543
TM
® _{2.4-2.5 GHz Front-End Module with Internally}
Matched Power Amplifier and SP3T Switch
PRODUCTION DATA SHEET
DESCRIPTION
LX5543 is a WLAN front-end provides about 25dB power gain, and
module (FEM) for 802.11b/g/n and +17dBm linear output power, with
other applications in the 2.4-2.5GHz EVM (<3%) for 64QAM/ 54Mbps
frequency range. LX5543 integrates OFDM. Both gain and power are
an advanced InGaP/GaAs Hetero- readily measured at antenna port, with
junction Bipolar Transistor (HBT) the insertion loss of the SP3T switch
power amplifier with on chip included.
impedance matching and a Depletion The Rx path of LX5543 features low
mode pHEMT (D-pHEMT) single- insertion loss of 0.6dB and high input
pole triple-throw (SP3T) switch in a referred 1dB gain compression point
single package with 3x3mm footprint. (IP_1dB) of +25dBm. Bluetooth path of
LX5543 provides capability of sharing LX5543 features insertion loss 0.9dB,
a single antenna between WLAN and and IP_1dB of +29dBm.
Bluetooth systems through the SP3T LX5543 is available in a 16-pin, low
switch.
profile of 0.55mm, 3x3mm² micro-
The Tx path of LX5543 features a lead package (MLPQ-16L). With its
two-stage monolithic microwave high level of functional integration,
integrated circuit (MMIC) power best-class performance, compact
amplifier with active bias circuitry, footprint and low profile, LX5543
on-chip output power detector, and offers an ideal front-end solution for
50 input/output matching inside the the ever demanding design require-
package. With 3.6V supply voltage ments of today’s highly integrated
and 82mA bias current, the Tx path
mobile equipments, including 802.11
b/g/n and Bluetooth applications.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
KEY FEATURES
 2.4-2.5GHz 802.11b/g/n Front-
End Solution in a Single MLP
Package
 SP3T for Sharing Antenna
between WLAN and Bluetooth
systems
 All RF I/O Matched to 50 
 Single-Supply Voltage 3.0V to
4.2V
 Small Footprint: 3x3mm²
 Low Profile: 0.55mm
 RoHS Compliant & Pb-Free
TX Features :
 Power Gain ~ 25dB*
 Pout ~ +17dBm* for 3% EVM
at Antenna
 Current ~145mA at +17dBm*
 Pout ~ +21dBm* for 11b 1Mbps
DSSS Mask Compliance
 Quiescent Current ~ 82mA
RX Features :
 Insertion Loss ~ 0.6 dB
 IP_1dB ~ +25 dBm
Bluetooth Path :
 Insertion Loss ~ 0.9 dB
 IP_1dB ~ +29 dBm
* Including SP3T switch loss
APPLICATIONS
 IEEE 802.11b/g/n
 Mobile Phone WLAN module
BLOCK DIAGRAM
Vref Vc1
PAOut/
Vc2 SwIn
TxIn
Det
RxOut
IMN*
PA
BT
*IMN:
Input Matching Network
*OMN:
Output Matching Network
OMN*
Antenna
Port
CtrlTx / CtrlRx / CtrlBT
Copyright  2010
Rev. 1.0, 2010-03-18
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: [phone]
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