JANTX1N4946 Datasheet, PDF (1/2 Pages) Microsemi Corporation – VOIDLESS-HERMETICALLY SEALED FAST RECOVERY GLASS RECTIFIERS

SCOTTSDALE DIVISION
1N4942 thru 1N4948
VOIDLESS-HERMETICALLY SEALED
FAST RECOVERY GLASS RECTIFIERS
DESCRIPTION
APPEARANCE
This “fast recovery” rectifier diode series is military qualified to MIL-PRF-19500/359
and is ideal for high-reliability applications where a failure cannot be tolerated.
These industry-recognized 1.0 Amp rated rectifiers for working peak reverse
voltages from 200 to 1000 volts are hermetically sealed with voidless-glass
construction using an internal “Category I” metallurgical bond. These devices are
similar in ratings to the 1N5615 thru 1N5623 series where surface mount MELF
package configurations are also available by adding a “US” suffix (see separate
data sheet for 1N5615US thru 1N5623US). Microsemi also offers numerous other
rectifier products to meet higher and lower current ratings with various recovery time
speed requirements including fast and ultrafast device types in both through-hole
and surface mount packages.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
“A” Package
FEATURES
APPLICATIONS / BENEFITS
• Popular JEDEC registered 1N4942 to 1N4948 series
• Voidless hermetically sealed glass package
• Triple-Layer Passivation
• Internal “Category I” Metallurgical bonds
• Working Peak Reverse Voltage 200 to 1000 Volts.
• JAN, JANTX, and JANTXV available per MIL-PRF-
19500/359 (for JANS, see 1N5615 thru 1N5623)
• Surface mount equivalents also available in a square
end-cap MELF configuration with “US” suffix (see
separate data sheet for 1N5615US thru 1N5623US)
• Fast recovery 1 Amp rectifiers 200 to 1000 V
• Military and other high-reliability applications
• General rectifier applications including bridges, half-
bridges, catch diodes, etc.
• High forward surge current capability
• Extremely robust construction
• Low thermal resistance
• Controlled avalanche with peak reverse power
capability
• Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
• Junction & Storage Temperature: -65^oC to +175^oC
• Thermal Resistance: 38^oC/W junction to lead at 3/8
inch (10 mm) lead length from body
• Thermal Impedance: 4.5^oC/W @ 10 ms heating time
• Average Rectified Forward Current (I_O): 1.0 Amps @
T_A = 55ºC and 0.750 Amps at T_A = 100ºC
• Forward Surge Current: 15 Amps @ 8.3 ms half-sine
• Solder Temperatures: 260ºC for 10 s (maximum)
MECHANICAL AND PACKAGING
• CASE: Hermetically sealed voidless hard glass with
Tungsten slugs
• TERMINATIONS: Axial leads are copper with
Tin/Lead (Sn/Pb) finish
• MARKING: Body paint and part number, etc.
• POLARITY: Cathode band
• TAPE & REEL option: Standard per EIA-296
• WEIGHT: 340 mg
• See package dimensions on last page
ELECTRICAL CHARACTERISTICS
TYPE
WORKING MINIMUM
PEAK BREAKDOWN
REVERSE VOLTAGE
VOLTAGE
V_RWM
B_V @ 50µA
VOLTS
VOLTS
JAN1N4942 200
220
JAN1N4944 400
440
JAN1N4946 600
660
JAN1N4947 800
880
JAN1N4948 1000
1100
NOTE 1: T_A = 100^oC, 8.3 ms surges
AVERAGE
RECTIFIED
CURRENT
MAXIMUM
FORWARD
VOLTAGE
MAXIMUM
REVERSE
CURRENT
Maximum
CAPACITANCE
I_O
V_F @ 1 A
I_R @ V_RWM
C @ -12V
AMPS
VOLTS
µA
pF
55^oC 100^oC
25^oC 150^oC
1.00 .750
1.3
1.0
200
45
1.00 .750
1.3
1.0
200
35
1.00 .750
1.3
1.0
200
25
1.00 .750
1.3
1.0
200
20
1.00 .750
1.3
1.0
200
15
NOTE 2: I_F = 0.5A, I_RM = 1A, I_R(REC) = .250A
MAXIMUM
SURGE
CURRENT
(NOTE 1)
I_FSM
AMPS
15
15
15
15
15
MAXIMUM
REVERSE
RECOVERY
(NOTE 2)
t_rr
ns
150
150
250
250
500
Copyright  2004
12-08-2004 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
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