JAN1N4148-1 Datasheet, PDF (1/4 Pages) Microsemi Corporation – Glass Axial Switching Diode

1N4148-1
Available on
commercial
versions
Glass Axial Switching Diode
Qualified per MIL-PRF-19500/116
DESCRIPTION
This popular 1N4148-1 JEDEC registered switching/signal diode features internal
metallurgical bonded construction for military grade products per MIL-PRF-19500/116. This
small low capacitance diode, with very fast switching speeds, is hermetically sealed and
bonded into a double-plug DO-35 package. It may be used in a variety of very high speed
applications including switchers, detectors, transient OR'ing, logic arrays, blocking, as well as
low-capacitance steering diodes, etc. Microsemi also offers a variety of other switching/signal
diodes.
Qualified Levels:
JAN, JANTX, and
JANTXV
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• Popular JEDEC registered 1N4148 number.
• Hermetically sealed glass construction.
• Metallurgically bonded.
• Double plug construction.
• Very low capacitance.
• Very fast switching speeds with minimal reverse recovery times.
• JAN, JANTX, and JANTXV qualifications are available per MIL-PRF-19500/116.
• MSP screening is also available in reference to MIL-PRF-19500 (JANS).
(See part nomenclature for all available options.)
• RoHS compliant version available (commercial grade only).
APPLICATIONS / BENEFITS
• High frequency data lines.
• Small size for high density mounting using flexible thru-hole leads (see package illustration).
• RS-232 & RS–422 interface networks.
• Ethernet 10 base T.
• Low capacitance steering or blocking.
• LAN.
• Computers.
MAXIMUM RATINGS @ 25 ºC unless otherwise stated
DO-35 (DO-204AH)
Package
Also available in:
DO-213AA package
(surface mount)
1N4148UR-1
UB package
(surface mount)
1N4148UB
UB2 package
(2-Pin surface mount)
1N4148UB2
UBC package
(Ceramic Lid surface mount)
1N4148UBC
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead ⁽¹⁾
Thermal Resistance Junction-to-Ambient ⁽²⁾
Maximum Breakdown Voltage
Working Peak Reverse Voltage
Average Rectified Current @ TA = 75 ºC ⁽³⁾
Non-Repetitive Sinusoidal Surge Current (tp = 8.3 ms)
Symbol
TJ & TSTG
RÓ¨JL
RÓ¨JA
V(_BR)
VRWM
IO
IFSM
Value
-65 to +175
250
325
100
75
200
2
Unit
o_C
o_C/W
o_C/W
V
V
mA
A (pk)
NOTES: 1. Lead length = .375 inch (9.35 mm). See Figure 2 for thermal impedance curves.
2. TA = +75°C on printed circuit board (PCB), PCB = FR4 - .0625 inch (1.59 mm) 1-layer 1-Oz Cu,
horizontal, in still air; pads for axial = .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x 1 inch
(25.4 mm) long, lead length L ≤ 0.187 inch (≤ 4.75 mm); RӨJA with a defined PCB thermal resistance
condition included, is measured at IO = 200 mA.
3. See Figure 1 for derating.
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
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[phone]
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MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
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Website:
www.microsemi.com
T4-LDS-0281, Rev. 1 (121567)
©2012 Microsemi Corporation
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