1N6626US_09 Datasheet, PDF (1/4 Pages) Microsemi Corporation – VOIDLESS-HERMETICALLY-SEALED SURFACE MOUNT ULTRA FAST RECOVERY GLASS RECTIFIERS

SCOTTSDALE DIVISION
1N6626US thru 1N6631US
VOIDLESS-HERMETICALLY-SEALED
SURFACE MOUNT ULTRA FAST
RECOVERY GLASS RECTIFIERS
DESCRIPTION
APPEARANCE
This “Ultrafast Recovery” rectifier diode series is military qualified to MIL-PRF-
19500/590 and is ideal for high-reliability applications where a failure cannot be
tolerated. These industry-recognized 2.0 to 4.0 Amp rated rectifiers for working
peak reverse voltages from 200 to 1000 volts are hermetically sealed with voidless-
glass construction using an internal “Category I” metallurgical bond. These devices
are also available in axial-leaded packages for thru-hole mounting (see separate
data sheet for 1N6626 thru 1N6631). Microsemi also offers numerous other rectifier
products to meet higher and lower current ratings with various recovery time speed
requirements including standard, fast and ultrafast device types in both through-hole
and surface mount packages.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
Package “E”
or D-5B
FEATURES
APPLICATIONS / BENEFITS
• Surface mount series equivalent to the JEDEC registered
1N6626 to 1N6631 series
• Voidless hermetically sealed glass package
• Extremely robust construction
• Triple-layer passivation
• Internal “Category I” Metallurgical bonds
• JAN, JANTX, and JANTXV available per MIL-PRF-
19500/590
• Further options for screening in accordance with MIL-
PRF-19500 for JANS by using a “SP” prefix, e.g.
SP6626US, SP6629US, etc.
• Axial-leaded equivalents also available (see separate data
sheet for 1N6626 thru 1N6631)
• Ultrafast recovery rectifier series 200 to 1000 V
• Military and other high-reliability applications
• Switching power supplies or other applications
requiring extremely fast switching & low forward
loss
• High forward surge current capability
• Low thermal resistance
• Controlled avalanche with peak reverse power
capability
• Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
• Junction Temperature: -65^oC to +150^oC
• Storage Temperature: -65^oC to +175^oC
• Peak Forward Surge Current @ 25^oC: 75A (except
1N6631 which is 60A)
Note: Test pulse = 8.3ms, half-sine wave.
• Average Rectified Forward Current (I_O) at T_EC = +110^oC:
1N6626US thru 1N6628US
2.3 A
1N6629US thru 1N6631US
1.8 A
(Derate linearly at 2.5%/^oC for T_EC > +110^oC)
• Average Rectified Forward Current (I_O) at T_A=25^oC:
1N6626US thru 1N6628US
1.75 A
1N6629US thru 1N6631US
1.40 A
(Derate linearly at 0.80%/ ^oC for T_A>+25^oC. This I_O rating
is for PC boards where thermal resistance from mounting
point to ambient is sufficiently controlled where T_J(max) is
not exceeded. See latest issue of MIL-PRF-19500/590)
• Thermal Resistance junction to endcap (R_θJEC): 6.5^oC/W
• Capacitance at V_R= 10 V: 40 pF
• Solder temperature: 260^oC for 10 s (maximum)
MECHANICAL AND PACKAGING
• CASE: Hermetically sealed voidless hard glass
with Tungsten slugs
• TERMINATIONS: End caps are Copper with
Tin/Lead (Sn/Pb) finish. Note: Previous
inventory had solid Silver end caps with
Tin/Lead finish.
• MARKING: Cathode band only
• POLARITY: Cathode indicated by band
• Tape & Reel option: Standard per EIA-481-B
• Weight: 539 mg
• See package dimensions and recommended
pad layout on last page
Copyright © 2009
10-30-2009 REV G, SD53A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
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