1N6469US Datasheet, PDF (1/3 Pages) Microsemi Corporation – VOIDLESS HERMETICALLY SEALED SURFACE MOUNT UNDIRECTIONAL TRANSIENT SUPPRESSORS

SCOTTSDALE DIVISION
1N6469US thru 1N6476US
Voidless-Hermetically-Sealed Surface
Mount Unidirectional Transient
Suppressors
DESCRIPTION
APPEARANCE
This surface mount series of industry recognized voidless-hermetically-sealed
Unidirectional Transient Voltage Suppressor (TVS) designs is military qualified to MIL-
PRF-19500/552 and are ideal for high-reliability applications where a failure cannot be
tolerated. They provide a Working Peak “Standoff” Voltage selection from 5.0 to 51.6
Volts with 1500 W ratings. They are very robust in hard-glass construction and also
use an internal metallurgical bond identified as Category I for high reliability
applications. The 1500 W series is military qualified to MIL-PRF-19500/552. These
devices are also available in axial-leaded packages for thru-hole mounting by deleting
the “US” suffix (see separate data sheet for 1N6469 thru 1N6476A). Microsemi also
offers numerous other TVS products to meet higher and lower peak pulse power and
voltage ratings in both through-hole and surface-mount packages.
Package “G”
(or “D-5C”)
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
• High surge current and peak pulse power provides
transient voltage protection for sensitive circuits
• Triple-layer passivation
• Internal “Category I” metallurgical bonds
• Voidless hermetically sealed glass package
• JAN/TX/TXV military qualifications available per MIL-
PRF-19500/552 by adding JAN, JANTX, or JANTXV
prefix
• Further options for screening in accordance with MIL-
PRF-19500 for JANS by using a “MSP” prefix, e.g.
MSP6469, MSP6476, etc.
• Axial-leaded equivalents are also available (see
separate data sheet for 1N6469 thru 1N6476)
• Military and other high reliability transient protection
• Extremely robust construction
• Working Peak “Standoff” Voltage (V_WM) from 5.0 to
51.6 V
• Available as 1500 W Peak Pulse Power (P_PP)
• ESD and EFT protection per IEC61000-4-2 and
IEC61000-4-4 respectively
• Secondary lightning protection per select levels in
IEC61000-4-5
• Square-end-cap terminals for easy mounting
• Nonsensitive to ESD per MIL-STD-750 Method
1020
• Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
• Operating & Storage Temperature: -55^oC to +175^oC
• Peak Pulse Power at 25^oC: 1500 Watts @ 10/1000 µs
(also see Figures 1,2 and 4)
• Impulse repetition rate (duty factor): 0.01%
• Forward Surge Current: 130 Amps@ 8.33 ms one-
half sine wave
• CASE: Hermetically sealed voidless hard glass
with Tungsten slugs
• TERMINATIONS: Axial-leads are Tin/Lead (Sn/Pb)
over copper
• MARKING: Body painted and part number, etc.
• POLARITY: Cathode band
• Forward Voltage: 1.5 V @ 4 Amps dc and 4.8 V at
• Tape & Reel option: Standard per EIA-481-B
100 Amps (pulsed)
• Steady-State Power: 3.0 W @ T_A = 25^oC (see note
below and Figure 4)
• Weight: 1100 mg
• See package dimensions on last page
• Thermal Resistance Junction to End Cap: 20.0 ^oC/W
• Solder Temperatures: 260^oC for 10 s (maximum)
NOTE: Steady-state power ratings with reference to ambient are for PC boards where thermal resistance from
mounting point to ambient is sufficiently controlled where T_J(MAX) is not exceeded.
Copyright  2004
11-01-2004 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
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