1N6461US Datasheet, PDF (1/3 Pages) Microsemi Corporation – Voidless-Hermetically-Sealed Surface Mount Unidirectional Transient

SCOTTSDALE DIVISION
1N6461US thru 1N6468US
Voidless-Hermetically-Sealed Surface
Mount Unidirectional Transient
DESCRIPTION
This surface mount series of industry recognized voidless-hermetically-sealed
Unidirectional Transient Voltage Suppressor (TVS) designs is military qualified to MIL-
PRF-19500/551 and are ideal for high-reliability applications where a failure cannot be
tolerated. They provide a Working Peak “Standoff” Voltage selection from 5.0 to 51.6
Volts with 500 W ratings. They are very robust in hard-glass construction and also use
an internal metallurgical bond identified as Category I for high reliability applications.
The 500 W series is military qualified to MIL-PRF-19500/551. These devices are also
available in axial-leaded packages for thru-hole mounting by deleting the “US” suffix
(see separate data sheet for 1N6461 thru 1N6468). Microsemi also offers numerous
other TVS products to meet higher and lower peak pulse power and voltage ratings in
both through-hole and surface-mount packages.
APPEARANCE
Package “E”
(or “D-5B”)
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
• High surge current and peak pulse power provides
transient voltage protection for sensitive circuits
• Triple-layer passivation
• Internal “Category I” metallurgical bonds
• Voidless hermetically sealed glass package
• JAN/TX/TXV military qualifications available per MIL-
PRF-19500/551 by adding JAN, JANTX, or JANTXV
prefix
• Further options for screening in accordance with MIL-
PRF-19500 for JANS by using a “MSP” prefix, e.g.
MSP6462, MSP6468, etc.
• Axial-leaded equivalents are also available in a
square-end-cap MELF configuration (see separate
data sheet for 1N6461 thru 1N6168)
• Military and other high reliability transient protection
• Extremely robust construction
• Working Peak “Standoff” Voltage (V_WM) from 5.0 to
51.6 V
• Available as 500 W Peak Pulse Power (P_PP)
• ESD and EFT protection per IEC61000-4-2 and
IEC61000-4-4 respectively
• Secondary lightning protection per select levels in
IEC61000-4-5
• Square-end-cap terminals for easy placement
• Nonsensitive to ESD per MIL-STD-750 Method
1020
• Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
• Operating & Storage Temperature: -55^oC to +175^oC
• Peak Pulse Power at 25^oC: 500 Watts @ 10/1000 µs
(also see Figures 1,2 and 4)
• Impulse repetition rate (duty factor): 0.01%
• Forward Surge Current: 80 Amps@ 8.33 ms one-half
sine wave
• CASE: Hermetically sealed voidless hard glass
with Tungsten slugs
• TERMINATIONS: End caps are solid silver with
Tin/Lead (Sn/Pb) finish
• MARKING: None
• POLARITY: Cathode band
• Forward Voltage: 1.5 V @ 1 Amp dc and 4.8 V at 100
• Tape & Reel option: Standard per EIA-481-B
Amps (pulsed)
• Steady-State Power: 2.5 Watts @ T_A = 25^oC (see
note below and Figure 4)
• Weight: 539 mg
• See package dimensions on last page
• Thermal Resistance Junction to End Cap: 20 ^oC/W
• Solder Temperatures: 260^oC for 10 s (maximum)
NOTE: Steady-state power ratings with reference to ambient are for PC boards where thermal resistance from
mounting point to ambient is sufficiently controlled where T_J(MAX) is not exceeded.
Copyright  2004
11-01-2004 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
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