1N5913BUR-1 Datasheet, PDF (1/3 Pages) Microsemi Corporation – METALLURGICALLY BONDED GLASS SURFACE MOUNT 1.5 WATT ZENERS

SCOTTSDALE DIVISION
1N5913BUR-1 thru 1N5956BUR-1
(or MLL5913B thru MLL5956B)
METALLURGICALLY BONDED GLASS
SURFACE MOUNT 1.5 WATT ZENERS
DESCRIPTION
This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB
package is similar in electrical features to the JEDEC registered 1N5913B
thru 1N5956B axial-leaded package for 3.3 to 200 V. It is an ideal selection
for applications of high density and low parasitic requirements. Due to its
glass hermetic qualities and metallurgically enhanced internal contacts, it
may also be used for high reliability applications when required by a source
control drawing (SCD) or screening in accordance with MIL-PRF-19500 as
described in Features below. Zener voltage tolerance options are identified
by part number suffix including tight-tolerance. A variety of other Zener
product offerings and packages are available by Microsemi to meet higher
or lower power and test current applications.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
APPEARANCE
DO-213AB
FEATURES
• Electrically similar to the JEDEC registered 1N5913B
thru 1N5956B zener series
• Zener voltages available 3.3V to 200V
• Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers, e.g. MX1N5913BUR-1,
MV1N5923CUR-1, MSP1N5952DUR-1, etc.
• Surface mount equivalents also available as
SMBJ5913B to SMBJ5956B, SMBG5913B to
SMBG5956B, SMAJ5913B to SMAJ5956B, or as
1PMT5913B to 1PMT5956B (see separate data
sheets)
• Plastic body axial-leaded Zener equivalents are also
available as 1N5913BP to 1N5956BP (see separate
data sheet)
APPLICATIONS / BENEFITS
• Regulates voltage over a broad operating current
and temperature range
• Wide selection from 3.3 to 200 V
• Leadless package for surface mounting
• Ideal for high density mounting
• Metallurgically enhanced internal contact design for
greater reliability and lower thermal resistance
• Standard voltage tolerances are +/- 5% with B suffix
and 10 % with A suffix identification
• Tight tolerances available in plus or minus 2% or
1% with C or D suffix respectively
• Nonsensitive to ESD
• Hermetically sealed glass package
• Specified capacitance (see Figure 2)
• Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
• Power dissipation at 25^ºC: 1.5 watts (also see
derating in Figure 1).
• Operating and Storage temperature: -65^ºC to +175^ºC
• Thermal Resistance: 40 ^ºC/W junction to end cap, or
120^ºC/W junction to ambient when mounted on FR4
PC board (1 oz Cu) with recommended footprint (see
last page)
• Steady-State Power: 1.50 watts at T_EC < 115^oC, or
1.25 watts at T_A = 25^ºC when mounted on FR4 PC
board and recommended footprint as described for
thermal resistance (also see Figure 1)
• Forward voltage @200 mA: 1.2 volts (maximum)
• Solder Temperatures: 260 ^ºC for 10 s (max)
MECHANICAL AND PACKAGING
• CASE: Hermetically sealed DO-213AB glass MELF
package
• TERMINALS: End caps, tin-lead plated solderable
per MIL-STD-750, method 2026
• POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
• MARKING: Cathode band only
• TAPE & REEL optional: Standard per EIA-481-B
with 12 mm tape, 1500 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
• WEIGHT: 0.05 grams
• See package dimensions on last page
Copyright  2005
1-04-2005 REV D
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
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