1N5913BP Datasheet, PDF (1/3 Pages) Microsemi Corporation – Axial-Leaded 1.5 Watt Zener Diodes

SCOTTSDALE DIVISION
1N5913BP thru 1N5956BP (Plastic)
Axial-Leaded 1.5 Watt Zener Diodes
DESCRIPTION
The 1N5913-5956B series of 1.5 watt Zeners provides voltage regulation in a
selection from 3.3 to 200 volts with different tolerances as identified by suffix
letter on the part. These plastic encapsulated Zeners have moisture
classification of Level 1 with no dry pack required. They are also available in
various military screening levels by adding a prefix identifier as described in
the Features below. The plastic molded Zeners with a P suffix provide a
lower thermal resistance (junction to lead) compared to the optional glass
body (G suffix) for these same JEDEC part numbers. Both package options
are available by Microsemi. Microsemi also offers numerous other Zener
products to meet higher or lower power and test-current applications.
APPEARANCE
DO-41 or
DO-204AL
(Plastic)
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
• JEDEC registered 1N5913 to 1N5956B
• Zener voltage available 3.3V to 200V
• Standard voltage tolerances are plus/minus 5% with
B suffix and 10 % with A suffix identification
• Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
• Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
• Surface mount equivalents available as SMBJ5913 to
SMBJ5956B or SMBG5913 to SMBG5956B
• Optional glass body axial-leaded Zeners available as
1N5913BG to 1N5956BG (see separate data sheet)
• Regulates voltage over a broad operating current
and temperature range
• Wide selection from 3.3 to 200 V
• Flexible axial-lead mounting terminals
• Nonsensitive to ESD
• Moisture classification is Level 1 per IPC/JEDEC
J-STD-020B with no dry pack required
• Specified capacitance (see Figure 3)
MAXIMUM RATINGS
• Power dissipation at 25^ºC: 1.5 watts (also see
derating in Figure 1).
• Operating and Storage temperature: -65^ºC to +150^ºC
• Thermal Resistance: 45 ^ºC/W junction to lead at 3/8
(10 mm) lead length from body, or 105^ºC/W junction
to ambient when mounted on FR4 PC board (1 oz
Cu) with 4 mm² copper pads and track width 1 mm,
length 25 mm
• Steady-State Power: 1.5 watts at T_L < 82.5^oC 3/8
inch (10 mm) from body, or 1.19 watts at T_A = 25^ºC
when mounted on FR4 PC board as described for
thermal resistance (also see Figure 1)
• Forward voltage @200 mA: 1.2 volts (maximum)
• Solder Temperatures: 260 ^ºC for 10 s (max)
MECHANICAL AND PACKAGING
• CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
• TERMINALS: Leads, tin-lead plated solderable per
MIL-STD-750, method 2026
• POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
• MARKING: Part number
• TAPE & REEL optional: Standard per EIA-296
(add “TR” suffix to part number)
• WEIGHT: 0.7 grams
• See package dimensions on last page
Copyright  2003
10-13-2003 REV B
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
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