1N5518BUR-1 Datasheet, PDF (1/3 Pages) Microsemi Corporation – Low Voltage Surface Mount 500 mW Avalanche Diodes

SCOTTSDALE DIVISION
IN5518BUR-1 thru 1N5546BUR-1
(or MLL5518B-1 thru MLL5546B-1)
Low Voltage Surface Mount
500 mW Avalanche Diodes
DESCRIPTION
The 1N5518BUR-1 thru 1N5546BUR-1 series of 0.5 watt glass surface
mount Zener voltage regulators provides a selection from 3.3 to 33 volts in
standard 5% tolerances as well as tighter tolerances identified by different
suffix letters on the part number. These have an internal-metallurgical-bond
option as identified by the “–1” suffix. This internally bonded Zener package
construction is also in JAN, JANTX, and JANTXV military qualifications.
Microsemi also offers numerous other Zener products to meet higher and
lower power applications.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
APPEARANCE
DO-213AA
FEATURES
• Surface mount equivalent to JEDEC registered
1N5518 thru 1N5546 series
• Internal metallurgical bond with the “-1” suffix
• Also available in JAN, JANTX, and JANTXV
qualifications per MIL-PRF-19500/437 by adding
the JAN, JANTX, or JANTXV prefixes to part
numbers for desired level of screening; (e.g.
JANTX1N4099UR-1, JANTXV1N4109CUR-1, etc.)
• Nonbonded types also available without the “-1”
suffix for both the axial and surface mount
packages
• DO-7 or DO-35 glass body axial-leaded Zener
equivalents also available per JEDEC registration
with part numbers 1N5518 thru 1N5546 on
separate data sheets
APPLICATIONS / BENEFITS
• Regulates voltage over a broad operating current
and temperature range
• Extensive selection from 3.3 to 33 V
• Standard voltage tolerances are plus/minus 5% with
a “B” suffix, e.g. 1N5518BUR-1, etc.
• Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively, e.g. 1N5518CUR-1,
1N5518DUR-1, etc.
• Hermetically sealed surface mount package
• Nonsensitive to ESD per MIL-STD-750 Method 1020
• Minimal capacitance (see Figure 3)
• Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
• Operating and Storage temperature: -65^ºC to
+175^ºC
• Thermal Resistance: 100 ^ºC/W junction to end cap,
or 250^ºC/W junction to ambient when mounted on
FR4 PC board (1 oz Cu) with recommended
footprint (see last page)
• Steady-State Power: 0.5 watts at end cap
temperature T_EC < 125^oC or at ambient T_A < 50^ºC
when mounted on FR4 PC board as described for
thermal resistance above (see Figure 2 for
derating)
• Forward voltage @200 mA: 1.1 volts
• Solder Temperatures: 260 ^ºC for 10 s (max)
MECHANICAL AND PACKAGING
• CASE: Hermetically sealed glass DO-213AA
(SOD80 or MLL34) MELF style package
• TERMINALS: End caps tin-lead plated solderable
per MIL-STD-750, method 2026
• POLARITY: Cathode indicated by band where
diode is to be operated with the banded end positive
with respect to the opposite end for Zener regulation
• MARKING: cathode band only
• TAPE & REEL option: Standard per EIA-481-1-A
with 12 mm tape, 2000 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
• WEIGHT: 0.04 grams
• See package dimensions on last page
Copyright  2003
10-31-2003 REV B
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
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