1N5342D Datasheet, PDF (1/3 Pages) Microsemi Corporation – Silicon 5 Watt Zener Diodes

SCOTTSDALE DIVISION
1N5333B thru 1N5388B, e3
Silicon 5 Watt Zener Diodes
DESCRIPTION
The 1N5333-5388B JEDEC registered series of axial-leaded 5.0 watt
Zeners provides voltage regulation in a selection from 3.3 to 200 volts with
different tolerances as identified by specific suffix letter on the part number.
These plastic encapsulated Zeners have moisture classification of Level 1
with no dry pack required and are also available in various military
equivalent screening levels by adding a prefix identifier as also described in
the Features section. They may be operated at high maximum dc currents
with adequate heat sinking with their comparatively low thermal resistance
design. Microsemi also offers numerous other Zener products to meet
higher and lower power applications.
APPEARANCE
T-18
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
• JEDEC registered 1N5333 to 1N5388B
• Zener voltage available 3.3V to 200V
• Standard voltage tolerances are plus/minus 5% with B
suffix and 10 % with A suffix identification
• Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
• Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, and JANTXV are available
by adding MQ, MX, or MV prefixes respectively to
part numbers.
• Surface mount equivalents available as SMBJ5333 to
SMBJ5388B, or SMBG5333B to SMBG5388B
• RoHS Compliant devices available by adding e3 suffix
APPLICATIONS / BENEFITS
• Regulates voltage over a broad operating current and
temperature range
• Wide selection from 3.3 to 200 V
• Flexible axial-lead mounting terminals
• Nonsensitive to ESD per MIL-STD-750 Method 1020
• Withstands high surge stresses
• Minimal changes of voltage versus current as
specified by voltage regulation (ΔV_Z)
• High specified maximum current (I_ZM) when
adequately heat sunk
• Moisture classification is Level 1 per IPC/JEDEC J-
STD-020B with no dry pack required
MAXIMUM RATINGS
• Power dissipation at 25^ºC: 5.0 watts (also see
derating in Figure 1).
• Operating and Storage temperature: -65^ºC to
+150^ºC
• Thermal Resistance: 25 ^ºC/W junction to lead at 3/8
(10 mm) lead length from body, or 85^ºC/W junction
to ambient when mounted on FR4 PC board (1oz
Cu) with 4 mm² copper pads and track width 1
mm, length 25 mm
• Steady-State Power: 5 watts at T_L < 25^oC 3/8 inch
(10 mm) from body, or 1.47 watts at T_A = 25^ºC
when mounted on FR4 PC described for thermal
resistance (also see Figure 1)
• Forward voltage @1.0 A: 1.2 volts (maximum)
• Solder Temperatures: 260 ^ºC for 10 s (max)
MECHANICAL AND PACKAGING
• CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
• TERMINALS: Leads, Tin-Lead or RoHS Compliant
annealed matte-Tin plating solderable per MIL-STD-
750, method 2026
• POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end.
• MARKING: Part number
• TAPE & REEL option: Standard per EIA-296 (add
“TR” suffix to part number)
• WEIGHT: 0.7 grams
• See package dimensions on last page
Copyright © 2008
8-06-2008 REV D
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
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