1N4744APTR8 Datasheet, PDF (1/3 Pages) Microsemi Corporation – Silicon 1 Watt Zener Diodes

SCOTTSDALE DIVISION
1N4728AP thru 1N4764AP,e3 (PLASTIC)
Silicon 1 Watt Zener Diodes
DESCRIPTION
The popular 1N4728AP thru 1N4764AP series of 1.0 watt Zeners provides
voltage regulation in a selection from 3.3 to 100 volts in 5% tolerances with
other tighter tolerances also available as identified by different suffix letters
in the part number. These plastic encapsulated Zeners are moisture
classified as Level 1 with no dry pack required. They are also available in
various military screening levels by adding a prefix identifier as described in
the Features below. These plastic molded Zeners with a P suffix provide a
lower thermal resistance compared to the glass-body (G suffix) option for
these same JEDEC part numbers. Both package options are available by
Microsemi in RoHS Compliant devices with an “e3” suffix. Microsemi also
offers numerous other Zener products to meet higher and lower power and
test current applications.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
APPEARANCE
DO-41 or
DO-204AL
(Plastic)
FEATURES
• JEDEC registered 1N4728A to 1N4764A
• Extensive voltage selection from 3.3 to 100 V
• Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
• Surface mount equivalents available as SMAJ4728A to
SMAJ4764A and MLL4728A to MLL4764A (consult
factory for others)
• RoHS Compliant devices available by adding “e3” suffix
APPLICATIONS / BENEFITS
• Regulates voltage over a broad operating current and
temperature range
• Standard voltage tolerances are plus/minus 5% with
A suffix and 10 % with no suffix identification
• Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
• Flexible axial-lead mounting terminals
• Nonsensitive to ESD per MIL-STD-750 Method 1020
• Moisture classification is Level 1 per IPC/JEDEC J-
STD-020B with no dry pack required
MAXIMUM RATINGS
• Power dissipation at 25^ºC: 1.0 watts (also see
derating in Figure 1).
• Operating and Storage temperature: -65^ºC to
+150^ºC
• Thermal Resistance: 45 ^ºC/W junction to lead at 3/8
(10 mm) lead length from body, or 105^ºC/W junction
to ambient when mounted on FR4 PC board (1 oz
Cu) with 4 mm² copper pads and track width 1 mm,
length 25 mm
• Steady-State Power: 1.0 watts at T_L < 105^oC 3/8
inch (10 mm) from body or at T_A < 45^ºC when
mounted on FR4 PC board as described for thermal
resistance above (also see Figure 1)
• Forward voltage @200 mA: 1.2 volts (maximum)
• Solder Temperatures: 260 ^ºC for 10 s (max)
MECHANICAL AND PACKAGING
• CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
• TERMINALS: Tin-Lead (Sn/Pb) or RoHS Compliant
annealed matte-Tin plating solderable per MIL-STD-
750, method 2026
• POLARITY: Cathode indicated by band. Diode to be
operated with the banded end positive with respect to
the opposite end for Zener regulation
• MARKING: Part number
• TAPE & REEL option: Standard per EIA-296 (add
“TR” suffix to part number)
• WEIGHT: 0.7 grams
• See package dimensions on last page
Copyright © 2005
10-18-2005 REV C
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
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