1N4728AUR Datasheet, PDF (1/3 Pages) Microsemi Corporation – SURFACE MOUNT 1.0W GLASS ZENDER DIODE

SCOTTSDALE DIVISION
1N4728UR thru 1N4764AUR
(or MLL4728A thru MLL4764A)
SURFACE MOUNT 1.0 W
GLASS ZENER DIODES
DESCRIPTION
This surface mountable 1 watt Zener diode series is electrically equivalent to
the 1N4728A thru 1N4764A registration in the DO-41 equivalent package
except that it meets the JEDEC surface mount outline DO-213AB. It is an
ideal selection for applications of high density and low parasitic requirements
for voltage regulation. Standard voltage tolerance is +/- 5% with tighter
tolerances available down to 1%. With its glass hermetic qualities, it may
also be used for high reliability applications when required by a source
control drawing (SCD).
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
APPEARANCE
DO-213AB
FEATURES
• Electrically similar to the JEDEC registered 1N4728
thru 1N4764 zener series
• Zener voltages available 3.3V to 100V
• Standard voltage tolerances are +/- 5% with “A” suffix
and 10 % with no suffix identification
• Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
• Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
• Surface mount equivalents also available as
SMAJ4728A to SMAJ4764A and SMAJ4728A to
SMAJ4764A
• Plastic body axial-leaded Zener equivalents are also
available as 1N4728A to 1N4764A
APPLICATIONS / BENEFITS
• Regulates voltage over a broad operating current
and temperature range
• Wide selection from 3.3 to 100 V
• Leadless package for surface mounting
• Ideal for high density mounting
• Nonsensitive to ESD
• Hermetically sealed glass package
• Specified capacitance (see Figure 2)
• Inherently radiation hard per MicroNote 050
MAXIMUM RATINGS
• Power dissipation at 25^ºC: 1.0 watts (also see derating
in Figure 1).
• Operating and Storage temperature: -65^ºC to +175^ºC
• Thermal Resistance: 50 ^ºC/W junction to end cap, or
130^ºC/W junction to ambient when mounted on FR4 PC
board (1 oz Cu) with recommended footprint (see last
page)
• Steady-State Power: 1.00 watts at T_EC < 125^oC, or
1.00 watts at T_A < 45^ºC when mounted on FR4 PC
board and recommended footprint as described for
thermal resistance (also see Figure 1)
• Forward voltage @200 mA: 1.2 volts (maximum)
• Solder Temperatures: 260 ^ºC for 10 s (max)
MECHANICAL AND PACKAGING
• CASE: Hermetically sealed DO-213AB glass MELF
• TERMINALS: Leads, tin-lead plated solderable per
MIL-STD-750, method 2026
• POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
• MARKING: Cathode band only
• TAPE & REEL optional: Standard per EIA-481-B
with 12 mm tape, 1500 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
• WEIGHT: 0.05 grams
• See package dimensions & recommended mounting
pad on last page
Copyright  2002
11-05-2003 REV C
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
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