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1N4245_04 Datasheet, PDF (1/2 Pages) Microsemi Corporation – OIDLESS-HERMETICALLY-SEALED STANDARD RECOVERY GLASS RECTIFIERS
SCOTTSDALE DIVISION
1N4245 thru 1N4249
VOIDLESS-HERMETICALLY-SEALED
STANDARD RECOVERY GLASS
RECTIFIERS
DESCRIPTION
This “standard recovery” rectifier diode series is military qualified to MIL-PRF-
19500/286 and is ideal for high-reliability applications where a failure cannot be
tolerated. These industry-recognized 1.0 Amp rated rectifiers for working peak
reverse voltages from 200 to 1000 volts are hermetically sealed with voidless-glass
construction using an internal “Category I” metallurgical bond. These devices are
similar in ratings to the 1N5614 thru 1N5622 series where surface mount MELF
package configurations are available by adding a “US” suffix (see separate data
sheet for 1N5614US thru 1N5622US). Microsemi also offers numerous other
rectifier products to meet higher and lower current ratings with various recovery time
speed requirements including fast and ultrafast device types in both through-hole
and surface mount packages.
APPEARANCE
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
• Popular JEDEC registered 1N4245 to 1N4249
series
• Voidless hermetically sealed glass package
• Triple-Layer Passivation
• Internal “Category I” Metallurgical bonds
• Working Peak Reverse Voltage 200 to 1000 Volts.
• JAN, JANTX, and JANTXV available per MIL-PRF-
19500/286 (for JANS, see 1N5614-5622 series)
• Surface mount equivalents also available in a
square end-cap MELF configuration with “US”
suffix (see separate data sheet for 1N5614US thru
1N5622US)
• Standard recovery 1 Amp rectifiers 200 to 1000 V
• Military and other high-reliability applications
• General rectifier applications including bridges,
half-bridges, catch diodes, etc.
• High forward surge current capability
• Extremely robust construction
• Low thermal resistance
• Controlled avalanche with peak reverse power
capability
• Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
• Junction & Storage Temperature: -65oC to +175oC
• Thermal Resistance: 42oC/W junction to lead at
3/8 inch (10 mm) lead length from body
• Thermal Impedance: 4.5oC/W @ 10 ms
• Average Rectified Forward Current (IO): 1.0 Amps
@ TA = 55ºC
• Forward Surge Current: 25 Amps @ 8.3 ms half-
sine
• Solder Temperatures: 260ºC for 10 s (maximum)
• CASE: Hermetically sealed voidless hard glass
with Tungsten slugs
• TERMINATIONS: Axial leads are copper with
Tin/Lead (Sn/Pb) finish
• MARKING: Body paint and part number, etc.
• POLARITY: Cathode band
• TAPE & REEL option: Standard per EIA-296
• WEIGHT: 340 mg
• See package dimensions on last page
ELECTRICAL CHARACTERISTICS
TYPE
WORKING
PEAK
REVERSE
VOLTAGE
VRWM
MINIMUM
BREAKDOWN
VOLTAGE
VBR @ 100µA
AVERAGE
RECTIFIED
CURRENT
IO @ TA = 55oC
MAXIMUM
FORWARD
VOLTAGE
VF @ 3 A
MAXIMUM
REVERSE
CURRENT
IR @ VRWM
VOLTS
VOLTS
AMPS
55oC
VOLTS
µA
25oC
150oC
1N4245
200
240
1.00
1.3
1.0
150
1N4246
400
480
1.00
1.3
1.0
150
1N4247
600
720
1.00
1.3
1.0
150
1N4248
800
960
1.00
1.3
1.0
150
1N4249
1000
1150
1.00
1.3
1.0
150
NOTE 1: IO = 1A, 8 ms surge
NOTE 2: IF = 0.5A, IRM = 1A, IR(REC) = .250A
MAXIMUM
SURGE
CURRENT
(NOTE 1)
IFSM
AMPS
25
25
25
25
25
MAXIMUM
REVERSE
RECOVERY
(NOTE 2)
trr
µSec.
5.0
5.0
5.0
5.0
5.0
Copyright  2004
12-07-2004 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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