1N3821 Datasheet, PDF (1/3 Pages) Microsemi Corporation – SILICON 1 WATT ZENER DIODES

SCOTTSDALE DIVISION
1N3821 thru 1N3830A
1 Watt Metal Case Zener Diodes
DESCRIPTION
This well established zener diode series for the 1N3821 thru 1N3830A
JEDEC registration in the glass hermetic sealed DO-13 package provides a
low voltage selection for 3.3 to 7.5 volts. It is also well suited for high-
reliability applications where it is available in JAN, JANTX, and JANTXV
military qualifications. Higher voltages are also available in the 1N3016
thru 1N3051 series (6.8 V to 200 V) in the same package (see separate
data sheet). Microsemi also offers numerous other Zener diode products
for a variety of other packages including surface mount.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
APPEARANCE
DO-13
(DO-202AA)
FEATURES
• Zener Voltage Range: 3.3 V to 7.5 V
• Hermetically sealed DO-13 metal package
• Internally solder-bonded construction.
• Also available in JAN, JANTX, JANTXV
qualifications per MIL-PRF19500/115 by adding the
JAN, JANTX, or JANTXV prefixes to part numbers
for desired level of screening, e.g. JANTX1N3821,
JANTXV1N3051A, etc.
• Surface mount also available with 1N3821UR-1
thru 1N30330AUR-1 series on separate data sheet
APPLICATIONS / BENEFITS
• Regulates voltage over a broad operating current
and temperature range
• Low voltage selection from 3.3 to 7.5 V
• Tight voltage tolerances available
• Low reverse (leakage) currents
• Nonsensitive to ESD
• Hermetically sealed metal package
• Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
• Operating Junction and Storage Temperatures:
-65^oC to +175^oC
• THERMAL RESISTANCE: 50^oC/W* junction to lead
at 0.375 inches (10 mm) from body or 110 ^oC/W
junction to ambient when leads are mounted on FR4
PC board with 4 mm² copper pads (1 oz) and track
width 1 mm, length 25 mm
• DC Power Dissipation*: 1 Watt at T_L < +125^oC 3/8”
(10 mm) from body or 1.0 Watts at T_L < +65^oC when
mounted on FR4 PC board as described for thermal
resistance above (also see Fig 1)
• Forward Voltage @ 200 mA: 1.5 Volts.
• Solder Temperatures: 260 ^o C for 10 s (maximum)
MECHANICAL AND PACKAGING
• CASE: DO-13 (DO-202AA), welded, hermetically
sealed metal and glass
• FINISH: All external surfaces are Tin-Lead (Pb/Sn)
plated and solderable per MIL-STD-750 method
2026
• POLARITY: Cathode connected case.
• WEIGHT: 1.4 grams.
• Tape & Reel option: Standard per EIA-296 (add
“TR” suffix to part number)
• See package dimensions on last page
* For further mounting reference, thermal resistance from junction to metal case may be reduced to < 20 ^oC/W
when mounting DO-13 metal case directly on heat sink.
Copyright  2003
11-06-2003 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, [phone], Fax: [phone]
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