67025 Datasheet, PDF (1/2 Pages) Micropac Industries – 4N41-SEVEN SEGMENT HERMETICALLY SEALED DISPLAY

67025 4N41-SEVEN SEGMENT HERMETICALLY SEALED DISPLAY
Mii
OPTOELECTRONIC PRODUCTS
DIVISION
Features:
• Hermetically Sealed
• Left Hand Decimal
• TTL Compatible
• High Luminous Intensity
• Large Character Height
Applications:
• High reliability systems
• Instrumentation panels
• Communication equipment
• Medical equipment
DESCRIPTION
The 67025 (4N41) is a hermetically sealed seven segment display. The high luminous intensity and large character height
make the 67025 ideal for most applications. This high reliability display is available in standard and screened versions.
ABSOLUTE MAXIMUM RATINGS
Storage Temperature..........................................................................................................................................-65°C to +125°C
Operating Free-Air Temperature Range ............................................................................................................-55°C to +100°C
Lead Solder Temperature (1/16” [1.6mm] below seating plane for 10s) ........................................................................... 260°C
Reverse Voltage at 25°C Free-Air Temperature
Each Segment .................................................................................................................................................................. 6V
Decimal Point..................................................................................................................................................................... 3V
Peak Forward Current at (or below) 70°C Free-Air Temperature (derate linearly to 100°C at the rate of 6.7mA/°C)
Each Segment or Decimal Point ...............................................................................................................................200mA
Average Forward Current at (or below) 70°C Free-Air Temperature (derate linearly to 100°C at the rate of 1mA/°C for each
segment or 8mA/°C for total device)
Each Segment or Decimal Point ..................................................................................................................................30mA
Package Dimensions
Schematic Diagram
A
F
B
G
E
C
D
D .P .
0.220
[5 .6 ]
0.180
[4 .6 ]
P IN 1
0.162 [4.11]
0.127 [3.23]
10°
0.127 [3.23]
0.760 [19.31]
0.740 [18.79]
A LL P IN S ^{0.012 [0.30]}
0.008 [0.305]
0.260 [6.60]
0.010 [0.310]
0.300 [7.62]
A LL P IN S
0.075 [1.90] M A X
0.022 [0.56]
0.018 [0.457]
A LL P IN S
0.045 [1.14] M IN
0.087 [2.20]
0.176 [4.500]
0.150 [3.81]
S E A T IN G P LA N E
14 1
13 2
12 3
11 4
10 5
96
87
0.410 [10.42]
0.390 [9.90]
0.075 [1.90] M A X
0.085 [2.16] M A X
0.100 [2.54] T.P .
12 PLACES
(S E E N O TE C .)
0.085 [2.15] M A X
A1
F2
ANODES
E ,F,G ,D P
3
NC 4
14 ^ANODES
A ,B ,
13 B
12 NC
11 G
NC 5
DP 6
E7
10 C
9
ANODES
C ,D
8D
N C -N O IN TE R N A L C O N N E C T IO N
NOTES:
a. All linear dimensions are in millimeters and parenthetically in inches.
b. Centerlines of character segments and decimal points are shown as dashed lines. Associated dimensions are nominal.
c. The true-position pin spacing is 2.54mm (0.10”) between centerlines. Each centerline is located within 0.26mm (0.010”) of it’s true longitudinal
position relative to pins 4 and 11.
MICROPAC INDUSTRIES, INC. OPTOELECTRONIC PRODUCTS DIVISION • 725 E.Walnut Str., Garland, TX 75040 • [phone] • Fax [phone]
www.micropac.com E-MAIL: OPTOSALES @ MICROPAC.COM
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