66291 Datasheet, PDF (1/3 Pages) Micropac Industries – GLOB TOP TRANSISTOR OUTPUT GULL WING DUAL CHANNEL OPTOCOUPLERS

66291
07/18/2006
Features:
GLOB TOP TRANSISTOR OUTPUT GULL WING
DUAL CHANNEL OPTOCOUPLERS
Applications:
MICROPAC
OPTOELECTRONIC PRODUCTS
DIVISION
• Low Input Current
• Glob Top Plastic Package
• SMT mounting Gull Wing Package
• Proton Radiation tolerant
• +1500V electrical isolation
• Eliminate ground loops
• Level shifting
• Line receiver
• Switching circuits
• Monitor and Detection circuits
DESCRIPTION
The 66291 contains 2 proton tolerant LEDs optically coupled to 2 silicon planar phototransistors. The optocoupler is in a
surface mount Glob Top molded plastic Gull Wing package with 0.050” lead spacing. The package eliminates the need for
thru-hole mounting and is well suited for high density applications.
ABSOLUTE MAXIMUM RATINGS
Input to Output Voltage ........................................................................................................................................................1500 V
Emitter-Collector Voltage ...........................................................................................................................................................7 V
Collector-Emitter Voltage (Value applies to emitter-base open-circuited & the input-diode equal to zero) ...........................30 V
Reverse Input Voltage ..............................................................................................................................................................6 V
Input Diode Continuous Forward Current at (or below) 65°C Free-Air Temperature (see note 1) ....................................60 mA
Peak Forward Input Current (Value applies for tw < 1µs, PRR < 300 pps) ..............................................................................1 A
Continuous Collector Current .............................................................................................................................................150 mA
Continuous Transistor Power Dissipation at (or below) 25°C Free-Air Temperature (see Note 2) ................................ 150 mW
Storage Temperature.......................................................................................................................................... -40°C to +125°C
Operating Free-Air Temperature Range.............................................................................................................. -40°C to +100°C
Lead Solder Temperature (10 seconds max.) .....................................................................................................................240°C
Notes:
1. Derate linearly above +65°C free-air temperature at the rate of 1.15 mA/°C.
2. Derate linearly above +25°C free-air temperature at the rate of 1.76 mW/°C.
PIN 1
MARK
Package Dimensions
0.158±0.002
A1 1
Schematic Diagram
8 C1
0.193±0.006
8X 0.016±0.001
6X 0.050±0.002
0.070 MAX.
8X 0.008±0.001
K1 2
A2 3
7 E1
6 C2
0.010±0.003
GULLWING 8 LEAD PACKAGE
ALL DIMENSIONS ARE IN INCHES
K2 4
5 E2
MICROPAC INDUSTRIES, INC. OPTOELECTRONIC PRODUCTS DIVISION • 725 E.Walnut St., Garland, TX 75040 • [phone] • Fax [phone]
www.micropac.com E-MAIL: OPTOSALES @ MICROPAC.COM