66287 Datasheet, PDF (1/3 Pages) Micropac Industries – TRANSISTOR OUTPUT GULL WING DUAL CHANNEL OPTOCOUPLERS

66287
06/06/06
TRANSISTOR OUTPUT GULL WING
DUAL CHANNEL OPTOCOUPLERS
MICROPAC
OPTOELECTRONIC PRODUCTS
DIVISION
Features:
Applications:
• High Reliability
• Hermetic Ceramic package
• SMT mounting / SOIC-8 footprint
• Proton Radiation tolerant
• +1000V electrical isolation
• Eliminate ground loops
• Level shifting
• Line receiver
• Switching circuits
• Monitor and Detection circuits
DESCRIPTION
The 66287 contains 2 proton tolerant LEDs optically coupled to 2 silicon planar phototransistors. The optocoupler is in a
hermetic ceramic Gullwing-8 package with a standard SOIC-8 footprint with 0.050” lead spacing. The package eliminates
the need for thru-hole mounting and is well suited for high density applications.
ABSOLUTE MAXIMUM RATINGS
Input to Output Voltage .........................................................................................................................................................1000V
Emitter-Collector Voltage ............................................................................................................................................................7V
Collector-Emitter Voltage (Value applies to emitter-base open-circuited & the input-diode equal to zero) ............................30V
Reverse Input Voltage ...............................................................................................................................................................6V
Input Diode Continuous Forward Current at (or below) 65°C Free-Air Temperature (see note 1) .....................................60mA
Peak Forward Input Current (Value applies for tw < 1µs, PRR < 300 pps) ...............................................................................1A
Continuous Collector Current ..............................................................................................................................................150mA
Continuous Transistor Power Dissipation at (or below) 25°C Free-Air Temperature (see Note 2) ................................. 150mW
Storage Temperature.......................................................................................................................................... -65°C to +150°C
Operating Free-Air Temperature Range.............................................................................................................. -55°C to +125°C
Lead Solder Temperature (10 seconds max.) .....................................................................................................................240°C
Notes:
1. Derate linearly above +65°C free-air temperature at the rate of 1.15 mA/°C.
2. Derate linearly above +25°C free-air temperature at the rate of 1.76 mW/°C.
Package Dimensions
Schematic Diagram
PIN 1
MARK
0.180 MAX.
A1 1
8 C1
0.150
8X 0.015±0.002
0.070 MAX.
6X 0.050 TYP.
K1 2
0.005±0.002
A2 3
0.005 MAX.
GULLWING 8 LEAD PACKAGE
ALL DIMENSIONS ARE IN INCHES
K2 4
7 E1
6 C2
5 E2
MICROPAC INDUSTRIES, INC. OPTOELECTRONIC PRODUCTS DIVISION • 725 E.Walnut St., Garland, TX 75040 • [phone] • Fax [phone]
www.micropac.com E-MAIL: OPTOSALES @ MICROPAC.COM