66166 Datasheet, PDF (1/2 Pages) Micropac Industries – Surface mountable on ceramic or printed circuit board

66166-XXX LINEAR OPTOCOUPLER
Mii
OPTOELECTRONIC PRODUCTS
DIVISION
Features:
• Hermetically sealed 6 pin LCC
• Surface mountable on ceramic or printed circuit
board
• High reliability
• High voltage electrical isolation – 1000 volts
• Base lead eliminated for improved noise immunity
• Screened per MIL-STD-883 upon request
DESCRIPTION
The 66166 linear optocoupler consists of one gallium arsenide infrared emitting diode optically coupled to a monolithic silicon
phototransistor detector and is sealed in a miniature ceramic leadless chip carrier. The miniature six pin ceramic package is
ideal for designs where board space and device weight are important design considerations. These devices have been
designed and specified to meet the requirements of switchmode power supplies and other applications requiring very closely
matched current transfer ratios (CTR), linearity and stable performance over the military temperature range. The internal base-
to-pin connection has been eliminated for improved noise immunity. The 66166 is available in commercial (-003), screened in
accordance with MIL-STD-883 (-000), and military temperature (-002) versions or tested to customer specifications.
ABSOLUTE MAXIMUM RATINGS
Lead Solder Temperature……(1/16 inch [1.6mm] from case for 10 seconds) ................................................................... 260°C
Average Input Current ..........................................................................................................................................................25mA
Peak Output Current………………(IF – 50% duty cycle, 1 ms pulse width).........................................................................50mA
Peak Transient Input Current……………..(IF - < µs pulse width, 300pps) .............................................................................1.0 A
Reverse Input Voltage ...........................................................................................................................................................5.0 V
Input Power Dissipation .......................................................................................................................................................45mW
Average Output Current ......................................................................................................................................................8.0mA
Peak Output Current ..........................................................................................................................................................16.0mA
Emitter-Base Reverse Voltage...............................................................................................................................................5.0 V
Supply and Output Voltage ...................................................................................................................................... -0.5 V to 20 V
Base Current ........................................................................................................................................................................5.0mA
Output Power Dissipation...................................................................................................................................................100mW
Package Dimensions
Schematic Diagram
P IN 1
ID E N T IF IE R
.250 [6.35]
.240 [6.10]
.175 [4.44]
.165 [4.19]
0.08 0 [2.03]
0.06 6 [1.68]
0.02 8 [0.71]
0.02 2 [0.56] ₂
1
6
0.09 8 [2.49]
0.08 2 [2.08]
0.05 5 [1.40]
0.04 5 [1.14]
3
4
5
0.10 5 [2.67]
0.09 5 [2.41]
0.07 0 [1.78]
0.06 0 [1.53]
A L L D IM E N S IO N S A R E IN IN C H E S [M IL L IM E T E R S ]
U N S P E C IF IE D T O LE R A N C E ±.005 IN C H E S
NC 6
A1
K2
5 _Vcc
4 _Vo
3 _GND
MICROPAC INDUSTRIES, INC. OPTOELECTRONIC PRODUCTS DIVISION • 725 E. Walnut St., Garland, TX 75040 • [phone] • Fax [phone]
www.micropac.com E-MAIL: [e-mail]