HAL114 Datasheet, PDF (8/9 Pages) Micronas – Unipolar Hall Switch IC

HAL114
µA
102
101
I_OH
100
10–1
10–2
10–3
10–4
V_OH = 24 V
V_DD = 5 V
–50 0
50 100 150 200 °C
T_A
Fig. 15: Typical output leakage current
versus temperature
Application Note
For electromagnetic immunity, it is recommended to ap-
ply a 330 pF minimum capacitor between V_DD (pin 1)
and Ground (pin 2).
For applications requiring robustness to conducted dis-
turbances (transients), a 220 Ω series resistor to pin 1
and a 4.7 nF capacitor between V_DD (pin1) and Ground
(pin 2) is recommended. The series resistor and the ca-
pacitor should be placed as close as possible to the IC.
R_V
220 Ω
V_DD
1 V_DD
4.7 nF
2 GND
R_L
OUT
3
Fig. 16: Recommended application circuit
Ambient Temperature
Due to the internal power dissipation, the temperature
on the silicon chip (junction temperature T_J) is higher
than the temperature outside the package (ambient tem-
perature T_A).
T_J = T_A + ∆T
At static conditions, the following equations are valid:
– for SOT-89A: ∆T = I_DD * V_DD * R_thJSB
– for TO-92UA: ∆T = I_DD * V_DD * R_thJA
For typical values, use the typical parameters. For worst
case calculation, use the max. parameters for I_DD and
R_th, and the max. value for V_DD from the application.
Data Sheet History
1. Final data sheet: “HAL114 Unipolar Hall Switch IC”,
June 10, 1998, 6251-456-1DS. First release of the final
data sheet.
MICRONAS INTERMETALL GmbH
Hans-Bunte-Strasse 19
D-79108 Freiburg (Germany)
P.O. Box 840
D-79008 Freiburg (Germany)
Tel. [phone]
Fax [phone]
E-mail: [e-mail]
Internet: http://www.intermetall.de
Printed in Germany
by Systemdruck+Verlags-GmbH, Freiburg (06/98)
Order No. 6251-456-1DS
8
All information and data contained in this data sheet are with-
out any commitment, are not to be considered as an offer for
conclusion of a contract nor shall they be construed as to
create any liability. Any new issue of this data sheet invalidates
previous issues. Product availability and delivery dates are ex-
clusively subject to our respective order confirmation form; the
same applies to orders based on development samples deliv-
ered. By this publication, MICRONAS INTERMETALL GmbH
does not assume responsibility for patent infringements or
other rights of third parties which may result from its use.
Reprinting is generally permitted, indicating the source. How-
ever, our prior consent must be obtained in all cases.
MICRONAS INTERMETALL