MT40A1G16HBA-083E Datasheet, PDF (13/19 Pages) Micron Technology – TwinDie 1.2V DDR4 SDRAM

16Gb: x16 TwinDie Single Rank DDR4 SDRAM
Current Specifications – Limits
When T_C > 85°C: I_DD0, I_DD1, I_DD2N, I_DD2NT, I_DD2Q, I_DD3N, I_DD3P, I_DD4R, I_DD4W, and I_DD5B must
be derated by 3%; I_DD2P must be derated by 40%.
5. When additive latency is enabled for I_DD1, current changes by approximately +4%.
6. When additive latency is enabled for I_DD2N, current changes by approximately +0%.
7. When DLL is disabled for I_DD2N, current changes by approximately –23%.
8. When CAL is enabled for I_DD2N, current changes by approximately –25%.
9. When gear-down is enabled for I_DD2N, current changes by approximately 0%.
10. When CA parity is enabled for I_DD2N, current changes by approximately +7%.
11. I_PP3N test and limit is applicable for all I_DD2x, I_DD3x, I_DD4x, I_DD6x, and I_DD8 conditions; that
is, testing I_PP3N should satisfy the I_PPs for the noted I_DD tests.
12. When additive latency is enabled for I_DD3N, current changes by approximately +0.6%.
13. When additive latency is enabled for I_DD4R, current changes by approximately +5%.
14. When read DBI is enabled for I_DD4R, current changes by approximately 0%.
15. When additive latency is enabled for I_DD4W, current changes by approximately +4%.
16. When write DBI is enabled for I_DD4W, current changes by approximately 0%.
17. When write CRC is enabled for I_DD4W, current changes by approximately –3%.
18. When CA parity is enabled for I_DD4W, current changes by approximately +12%.
19. When 2X REF is enabled for I_DD5B, current changes by approximately –14%.
20. When 4X REF is enabled for I_DD5B, current changes by approximately –33%.
21. Applicable for MR2 settings A7 = 0 and A6 = 0; manual mode with normal temperature
range of operation (0–85°C).
22. Applicable for MR2 settings A7 = 1 and A7 = 0; manual mode with extended tempera-
ture range of operation (0–95°C).
23. Applicable for MR2 settings A7 = 0 and A7 = 1; manual mode with reduced temperature
range of operation (0–45°C).
24. I_DD6R and I_DD6A values are typical.
Table 9: x16 I_DD, I_PP, and I_DDQ Current Limits – Rev. B, D
Symbol
DDR4-2133¹ DDR4-2400
I_DD0: One bank ACTIVATE-to-PRECHARGE
90
96
current
I_PP0: One bank ACTIVATE-to-PRECHARGE I_PP
6
6
current
I_DD1: One bank ACTIVATE-to-READ-to-PRE-
114
120
CHARGE current
I_DD2N: Precharge standby current
66
68
DDR4-2666
102
6
126
70
DDR4-2933
108
6
132
72
I_DD2NT: Precharge standby ODT current
I_DD2P: Precharge power-down current
I_DD2Q: Precharge quiet standby current
I_DD3N: Active standby current
I_PP3N: Active standby I_PP current
I_DD3P: Active power-down current
I_DD4R: Burst read current
90
100
100
110
50
50
50
50
60
60
60
60
80
86
92
98
6
6
6
6
78
82
86
90
250
270
292
314
Unit
mA
Notes
2, 3, 4
mA
mA
3, 4, 5
mA 4, 6, 7, 8,
9, 10, 11
mA
4, 11
mA
4, 11
mA
4, 11
mA
4, 11
mA
mA
4, 11
mA 4, 14, 13,
11
09005aef86573aa8
DDR4_16Gb_x16_1CS_TwinDie.pdf - Rev. E 12/16 EN
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