MT8KTF51264HZ Datasheet, PDF (10/18 Pages) Micron Technology – 1.35V DDR3L SDRAM SODIMM

1GB, 2GB, 4GB (x64, SR) 204-Pin DDR3L SODIMM
Electrical Specifications
Electrical Specifications
Stresses greater than those listed may cause permanent damage to the module. This is a
stress rating only, and functional operation of the module at these or any other condi-
tions outside those indicated in each device's data sheet is not implied. Exposure to ab-
solute maximum rating conditions for extended periods may adversely affect reliability.
Table 10: Absolute Maximum Ratings
Symbol
V_DD
V_IN, V_OUT
Parameter
V_DD supply voltage relative to V_SS
Voltage on any pin relative to V_SS
Min
–0.4
–0.4
Max
1.975
1.975
Units
V
V
Table 11: Operating Conditions
Symbol Parameter
V_DD V_DD supply voltage
V_REFCA(DC) Input reference voltage command/address bus
V_REFDQ(DC) I/O reference voltage DQ bus
I_VTT Termination reference current from V_TT
V_TT Termination reference voltage (DC) – command/
address bus
I_I
Input leakage current; Any input Address inputs,
0V ≤ V_IN ≤ V_DD; V_REF input 0V ≤ V_IN RAS#, CAS#,
≤ 0.95V (All other pins not under WE#, S#, CKE,
test = 0V)
ODT, BA, CK,
CK#
DM
I_OZ Output leakage current; 0V ≤
DQ, DQS, DQS#
V_OUT ≤ V_DD; DQ and ODT are disa-
bled; ODT is HIGH
I_VREF
T_A
T_C
V_REF supply leakage current; V_REFDQ = V_DD/2 or
V_REFCA = V_DD/2 (All other pins not under test = 0V)
Module ambient operating temperature
DDR3 SDRAM component case operating tempera-
ture
Min
1.283
1.425
0.49 × V_DD
0.49 × V_DD
–600
0.49 × V_DD -
20mV
–16
–2
–5
–8
0
0
Nom
1.35
1.5
0.5 × V_DD
0.5 × V_DD
–
0.5 × V_DD
0
0
0
0
–
–
Max
1.45
1.575
0.51 × V_DD
0.51 × V_DD
600
0.51 × V_DD +
20mV
16
Units
V
V
V
V
mA
V
µA
Notes
1
2
2
5
µA
8
µA
70
°C
3, 4
95
°C 3, 4, 5
Notes:
1. Module is backward-compatible with 1.5V operation. Refer to device specification for
details and operation guidance.
2. V_TT termination voltage in excess of the stated limit will adversely affect the command
and address signals’ voltage margin and will reduce timing margins.
3. T_A and T_C are simultaneous requirements.
4. For further information, refer to technical note TN-00-08: “Thermal Applications,”
available on Micron’s web site.
5. The refresh rate is required to double when 85°C < T_C ≤ 95°C.
PDF: 09005aef84577368
ktf8c128_256_512x64hz.pdf - Rev. K 7/15 EN
10
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