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MT9M112 Datasheet, PDF (1/2 Pages) Micron Technology – 1/4-Inch, 1.3 Megapixel CMOS Image Sensor System-on-Chip | |||
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MT9M112
1/4-Inch, 1.3 Megapixel CMOS Image Sensor
System-on-Chip
Features
â DigitalClarity⢠CMOS imaging technology
â VDD power disable switch for reduced standby current
â On-die phase lock loop (PLL)
â Programmable I/O slew rate
â 2 x 2 pixel binning
â Simple two-wire serial programming interface
â ITU-R BT.656 (YCbCr), 565RGB, 555RGB, or 444RGB
formats (progressive scan)
â System-on-chip (SOC)âa completely integrated
camera system
â Ultra low-power, low-cost, progressive scan CMOS
image sensor
â 1.3-megapixel resolution (1,280H x 1,024V)
â 1/4-inch optical format
â 15 frames per second (fps) at full resolution
â Superior low-light performance
â On-die image ï¬ow processor performs sophisticated
processing: color recovery and correction, sharpening,
gamma, lens shading correction, and on-the-ï¬y
defect correction
â Mechanical shutter support
â Filtered image downscaling to arbitrary size with
smooth, continuous zoom and pan
Getting the Pictureâ¦in Style
Mobile applications with small form factors are in
demand, and not surprisingly, customers are ex-
pecting to ï¬nd more features in their new slimmer,
sleeker cell phones. They want to snap a photo at
the family picnic or capture a good time with friends
at a party. The 1/4-inch, 1.3-megapixel SOC image
sensor opens the door to slim designs that take
great pictures. Its specially engineered microlenses
produce high-quality images and enable low-proï¬le
camera modules.
Focused on Design
The MT9M112 is a fully integrated system-on-chip
(SOC) sensor, incorporating additional logic on the
device that simpliï¬es the camera module design, re-
lated manufacturing processes, system integration,
power management, and component count. It in-
corporates sophisticated camera functions on-chip
and is programmable through a simple two-wire se-
rial interface. This yields more space and makes the
sensor easier to design with. Additionally, this de-
vice enables mobile phone manufacturers to simply
upgrade their existing 1/4-inch VGA cameras to 1/4-
inch megapixel cameras, occupying the same height
and footprint.
Enhanced Capabilities
The device features 2 x 2 pixel binning, programma-
ble input/output slew rate, mechanical shutter sup-
port, and continuous, smooth zoom and pan, as well
as day and night mode conï¬gurations. It has three-
channel gamma correction, lens shading correction,
and color correction. The camera control sequencer
automates the cameraâs ï¬ash and video clip snap-
shots. The device also has an on-board PLL and sup-
ports pixel binning as an enhanced form of image
size reduction.
You Get a Complete Solution
The MT9M112 is sure to improve your designs, as
will working with Micron. In addition to high-qual-
ity products, youâll also get the added advantages
of doing business with a top-tier supplier: advanced
technology, worldwide facilities, technical exper-
tise, and sales supportâa superior solution from an
industry leader.
Samples for this device are available now, and pro-
duction will commence in December of 2005. For
more information or to order the MT9M112, call
your Micron Imaging representative or visit Micronâs
Web site at www.micron.com/imaging.
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