MT8LSDT3264A Datasheet, PDF (1/24 Pages) Micron Technology – SYNCHRONOUS DRAM MODULE

SYNCHRONOUS
DRAM MODULE
256MB / 512MB (x64)
168-PIN SDRAM DIMMs
MT8LSDT3264A(I) - 256MB
MT16LSDT6464A(I) - 512MB
For the latest data sheet, please refer to the Micron Web
site: www.micron.com/moduleds
Features
• PC100- and PC133-compliant
• JEDEC-standard 168-pin, dual in-line memory
module (DIMM)
• Unbuffered
• 256MB (32 Meg x 64), 512MB (64 Meg x 64)
• Single +3.3V ±0.3V power supply
• Fully synchronous; all signals registered on positive
edge of system clock
• Internal pipelined operation; column address can
be changed every clock cycle
• Internal SDRAM banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8, or full page
• Auto Precharge, including Concurrent Auto
Precharge, and Auto Refresh Modes
• 64ms, 8,192 cycle Auto Refresh cycle
• Self Refresh Mode
• LVTTL-compatible inputs and outputs
• Serial Presence-Detect (SPD)
OPTIONS
MARKING
• Package
Unbuffered
168-pin DIMM (gold)
• Operating Temperature Range
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)¹
• Memory Clock/CAS Latency
(133 MHz)/CL = 2
(133 MHz)/CL = 3
(100 MHz)/CL = 2
A
G
None
I
-13E
-133
-10E
NOTE:
1. Consult Micron for availability; Industrial Tempera-
ture Option available in -133 speed only.
Table 1: Address Table
Refresh Count
Device Banks
Device Configuration
Row Addressing
Column Addressing
Module Banks
256MB
MODULE
8K
4 (BA0, BA1)
32 Meg x 8
8K (A0–A12)
1K (A0–A9)
1 (S0,S2)
512MB
MODULE
8K
4 (BA0, BA1)
32 Meg x 8
8K (A0–A12)
1K (A0–A9)
2 (S0,S2; S1,S3)
Figure 1: 168-Pin DIMM (MO–161)
Standard
Low Profile
Table 2: Timing parameters
MODULE
MARKINGS
-13E
-133
-10E
PC100
CL - ^tRCD - ^tRP
2-2-2
2-2-2
2-2-2
PC133
CL - ^tRCD - ^tRP
2-2-2
3-3-3
NA
Table 3: Part Numbers
PARTNUMBER¹
SYSTEM
CONFIGURATION BUS SPEED
MT8LSDT3264AG-13E_
32 Meg x 64 133 MHz
MT8LSDT3264AG(I)-133_ 32 Meg x 64 133 MHz
MT8LSDT3264AG-10E_
32 Meg x 64 100 MHz
MT16LSDT6464AG-13E_
64 Meg x 64 133 MHz
MT16LSDT6464AG(I)-133_ 64 Meg x 64 133 MHz
MT16LSDT6464AG-10E_
64 Meg x 64 100 MHz
NOTE:
1. The designators for component and PCB revision
are the last two characters of each part number.
Consult factory for current revision codes. Example:
MT8LSDT3264AG-133B1.
32,64 Meg x 64 SDRAM DIMMs
SD8_16C32_64x64AG_C.fm - Rev. C 11/02
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology Inc.