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MT48H8M32LF Datasheet, PDF (1/71 Pages) Micron Technology – 256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM | |||
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256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
Features
Mobile SDRAM
MT48H16M16LF â 4 Meg x 16 x 4 banks
MT48H8M32LF â 2 Meg x 32 x 4 banks
Features
⢠Fully synchronous; all signals registered on positive
edge of system clock
⢠VDD/VDDQ = 1.70â1.95V
⢠Internal, pipelined operation; column address can
be changed every clock cycle
⢠Four internal banks for concurrent operation
⢠Programmable burst lengths: 1, 2, 4, 8, or continuous
page1
⢠Auto precharge, includes concurrent auto precharge
⢠Auto refresh and self refresh modes
⢠LVTTL-compatible inputs and outputs
⢠On-chip temperature sensor to control refresh rate
⢠Partial-array self refresh (PASR)
⢠Deep power-down (DPD)
⢠Selectable output drive (DS)
⢠64ms refresh period (8,192 rows)
Options
⢠VDD/VDDQ
â 1.8V/1.8V
⢠Configuration
â 16 Meg x 16 (4 Meg x 16 x 4 banks)
â 8 Meg x 32 (2 Meg x 32 x 4 banks)
⢠Plastic âgreenâ package
â 54-ball VFBGA (8mm x 9mm)
â 90-ball VFBGA (8mm x 13mm)
⢠Timing â cycle time
â 7.5ns at CL = 3
â 8ns at CL = 3
⢠Power
â Standard IDD2P/IDD7
â Low IDD2P/IDD7
⢠Operating temperature range
â Commercial (0° to +70°C)
â Industrial (â40°C to +85°C)
⢠Design revision
Marking
H
16M16
8M32
BF
B5
-75
-8
None
L
None
IT
:G
Notes: 1. For continuous page burst, contact factory
for availability.
Table 1: Addressing
Configuration
Refresh count
Row addressing
Bank addressing
Column addressing
16 Meg x 16
4 Meg x 16 x 4
banks
8K
8K (A0âA12)
4 (BA0, BA1)
512 (A0âA8)
8 Meg x 32
2 Meg x 32 x 4
banks
8K
4K (A0âA11)
4 (BA0, BA1)
512 (A0âA8)
Table 2:
Key Timing Parameters
CL = CAS (READ) latency
Clock Rate
(MHz)
Access Time Data
Speed
Setup
Grade CL = 2 CL = 3 CL = 2 CL = 3 Time
-75 104 133 8ns 6ns 1.5ns
-8
100 125 9ns 7ns 2.5ns
Data
Hold
Time
1ns
1ns
PDF:09005aef8219eeeb/Source: 09005aef8219eedd
MT48H16M16LF__1.fm - Rev F 4/07 EN
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Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2006 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
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