MT36VDDF12872G Datasheet, PDF (1/37 Pages) Micron Technology – DDR SDRAM REGISTERED DIMM

DDR SDRAM
REGISTERED DIMM
1GB, 2GB (x72, ECC, DR)
184-PIN DDR RDIMM
MT36VDDF12872 – 1GB
MT36VDDF25672 – 2GB
For the latest data sheet, please refer to the Micron^ Web
site: www.micron.com/products/modules
Features
• 184-pin, dual in-line memory module (DIMM)
• Fast data transfer rates: PC1600, PC2100, or PC 2700
• Utilizes 200 MT/s, 266 MT/s, and 333 MT/s DDR
SDRAM components
• Registered Inputs with one-clock delay
• Phase-lock loop (PLL) clock driver to reduce loading
• Supports ECC error detection and correction
• 1GB (128 Meg x 72), 2GB, (256 Meg x 72)
• VDD = VDDQ = +2.5V; VDDSPD = +2.3V to +3.6V
• 2.5V I/O (SSTL_2 compatible)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs;
centeraligned with data for WRITEs
• Internal, pipelined double data rate (DDR)
architecture; two data accesses per clock cycle
• Bidirectional data strobe (DQS) transmitted/
received with data—i.e., source-synchronous data
capture
• Differential clock inputs CK and CK#
• Four internal device banks for concurrent operation
• Programmable burst lengths: 2, 4, or 8
• Auto precharge option
• Auto Refresh and Self Refresh Modes
• 7.8125µs maximum average periodic refresh
interval
• Serial Presence Detect (SPD) with EEPROM
• Programmable READ CAS latency
• Gold edge contacts
Table 1: Address Table
Refresh Count
Row Addressing
Device Bank Addressing
Device Configuration
Column Addressing
Module Rank Addressing
1GB
8K
8K (A0–A12)
4 (BA0, BA1)
256Mb
(64 Meg x 4)
2K (A0–A9,
A11)
2 (S0#, S1#)
2GB
8K
8K (A0–A12)
4 (BA0, BA1)
512Mb
(128 Meg x 4)
4K (A0–A9,
A11, A12)
2 (S0#, S1#)
Figure 1: 184-Pin DIMM (MO-206)
Standard 1.7in. (43.18mm)
Low-Profile (1GB) 1.2in. (30.48mm)
Low Profile (2GB) 1.2in. (30.48mm)
OPTIONS
MARKING
• Package
184-pin DIMM (standard)
G
184-pin DIMM (lead-free)¹
Y
• Memory Clock, Speed, CAS Latency²
6ns (166MHz), 333 MT/s, CL = 2.5
7.5ns (133 MHz), 266 MT/s, CL = 2
7.5ns (133 MHz), 266 MT/s, CL = 2
-335
-262¹
-26A¹
7.5ns (133 MHz), 266 MT/s, CL = 2.5
-265
10ns (100 MHz), 200 MT/s, CL = 2
-202
• PCB
Standard 1.7in. (43.18mm)
See page 2 note
Low-Profile 1.2in. (30.48mm)
See page 2 note
NOTE: 1. Contact Micron for product availability.
2. CL = CAS (READ) Latency; registered mode will
add one clock cycle to CL.
pdf: 09005aef80772fd2, source: 09005aef8075ebf6
DDF36C128_256x72G.fm - Rev. D 9/04 EN
1
©2004 Micron Technology, Inc. All rights reserved.
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE.