MT36KSF2G72PZ Datasheet, PDF (1/21 Pages) Micron Technology – 1.35V DDR3L SDRAM RDIMM

16GB (x72, ECC, DR) 240-Pin 1.35V DDR3L RDIMM
Features
1.35V DDR3L SDRAM RDIMM
MT36KSF2G72PZ – 16GB
Features
• DDR3L functionality and operations supported as
defined in the component data sheet
• 240-pin, registered dual in-line memory module
(RDIMM)
• Fast data transfer rates: PC3-12800 or PC3-10600
• 16GB (2 Gig x 72)
• V_DD = 1.35V (1.283–1.45V)
• V_DD = 1.5V (1.425–1.575V)
• V_DDSPD = 3.0–3.6V
• Backward compatible with standard 1.5V DDR3
systems
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Dual-rank
• On-board I²C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• 8 internal device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Figure 1: 240-Pin RDIMM (MO-269 R/C E2)
Module height: 30mm (1.181in)
Options
• Operating temperature¹
– Commercial (0°C ≤ T_A ≤ 70°C)
• Package
– 240-pin DIMM (halogen-free)
• Frequency/CAS latency
– 1.25ns @ CL = 11 (DDR3-1600)
– 1.5ns @ CL = 9 (DDR3-1333)
Marking
None
Z
-1G6
-1G4
Note: 1. Contact Micron for industrial temperature
module offerings.
Table 1: Key Timing Parameters
Speed
Grade
-1G6
-1G4
-1G1
-1G0
-80B
Industry
Nomenclature
PC3-12800
PC3-10600
PC3-8500
PC3-8500
PC3-6400
CL = 11 CL = 10
1600 1333
–
1333
–
–
–
–
–
–
Data Rate (MT/s)
CL = 9 CL = 8 CL = 7
1333 1066 1066
1333 1066 1066
–
1066 1066
–
1066
–
–
–
–
CL = 6
800
800
800
800
800
CL = 5
667
667
667
667
667
t_RCD
(ns)
13.125
13.125
13.125
15
15
t_RP
(ns)
13.125
13.125
13.125
15
15
t_RC
(ns)
48.125
49.125
50.625
52.5
52.5
PDF: 09005aef8479a029
ksf36c2gx72pz.pdf - Rev. I 7/15
1
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Products and specifications discussed herein are subject to change by Micron without notice.