PIC16CE62X_13 Datasheet, PDF (99/114 Pages) Microchip Technology – OTP 8-Bit CMOS MCU with EEPROM Data Memory

PIC16CE62X
20-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
B
2
n
1

c
A
A2

L
A1

Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
20
20
Pitch
p
.026
0.66
Overall Height
A
.068
.073
.078
1.73
1.85
1.98
Molded Package Thickness
A2
.064
.068
.072
1.63
1.73
1.83
Standoff
A1
.002
.006
.010
0.05
0.15
0.25
Overall Width
E
.299
.309
.322
7.59
7.85
8.18
Molded Package Width
E1
.201
.207
.212
5.11
5.25
5.38
Overall Length
D
.278
.284
.289
7.06
7.20
7.34
Foot Length
Lead Thickness
Foot Angle
L
.022
.030
.037
0.56
0.75
0.94
c
.004
.007
.010
0.10
0.18
0.25

0
4
8
0.00
101.60
203.20
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
.010
.013
.015
0.25
0.32
0.38

0
5
10
0
5
10

0
5
10
0
5
10
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-072
 1998-2013 Microchip Technology Inc.
DS40182D-page 99