TC4420_04 Datasheet, PDF (8/20 Pages) Microchip Technology – 6A High-Speed MOSFET Drivers

TC4420/TC4429
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
Pin No.
8-Pin CERDIP/
PDIP/SOIC
1
2
3
4
5
6
7
8
—
—
Pin No.
8-Pin DFN
1
2
3
4
5
6
7
8
PAD
—
Pin No.
5-Pin TO-220
—
1
—
2
4
5
—
3
—
TAB
Symbol
V_DD
INPUT
NC
GND
GND
OUTPUT
OUTPUT
V_DD
NC
V_DD
Description
Supply input, 4.5V to 18V
Control input, TTL/CMOS compatible input
No Connection
Ground
Ground
CMOS push-pull output
CMOS push-pull output
Supply input, 4.5V to 18V
Exposed Metal Pad
Metal Tab is at the V_DD Potential
3.1 Supply Input (V_DD)
The V_DD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 18V with respect to the ground
pins. The V_DD input should be bypassed to ground with
a local ceramic capacitor. The value of the capacitor
should be chosen based on the capacitive load that is
being driven. A minimum value of 1.0 µF is suggested.
3.2 Control Input
The MOSFET driver input is a high-impedance,
TTL/CMOS compatible input. The input circuitry of the
TC4420/TC4429 MOSFET driver also has a “speed-
up” capacitor. This helps to decrease the propagation
delay times of the driver. Because of this, input signals
with slow rising or falling edges should not be used, as
this can result in double-pulsing of the MOSFET driver
output.
3.3 CMOS Push-Pull Output
The MOSFET driver output is a low-impedance,
CMOS, push-pull style output capable of driving a
capacitive load with 6.0A peak currents. The MOSFET
driver output is capable of withstanding 1.5A peak
reverse currents of either polarity.
3.4 Ground
The ground pins are the return path for the bias current
and the high peak currents that discharge the load
capacitor. The ground pins should be tied into a ground
plane or have very short traces to the bias supply
source return.
3.5 Exposed Metal Pad
The exposed metal pad of the 6x5 DFN package is not
internally connected to any potential. Therefore, this
pad can be connected to a ground plane or other
copper plane on a printed circuit board (PCB) to aid in
heat removal from the package.
DS21419C-page 8
 2004 Microchip Technology Inc.