TC1262_13 Datasheet, PDF (8/14 Pages) Microchip Technology – 500mA Fixed Output CMOS LDO

TC1262
Package Dimensions (Continued)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
3-Pin TO-220
.113 (2.87)
.103 (2.62)
.410 (10.41)
.357 (9.06)
.258 (6.55)
.230 (5.84)
.156 (3.96)
.146 (3.71)
DIA.
.185 (4.70)
.165 (4.19)
.055 (1.40)
.045 (1.14)
.594 (15.09)
.569 (14.45)
3° - 7.5°
5 PLCS.
.560 (14.22)
.518 (13.16)
PIN 1
.244 (6.20)
.234 (5.94)
.055 (1.40)
.045 (1.14)
.037 (0.94)
.027 (0.69)
.105 (2.67)
.095 (2.41)
.205 (5.21)
.195 (4.95)
.020 (0.51)
.012 (0.30)
.115 (2.92)
.095 (2.41)
Dimensions: inches (mm)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
3-Pin DDPAK
.410 (10.41)
.385 (9.78)
.067 (1.70)
.045 (1.14)
.370 (9.40)
.330 (8.38)
.605 (15.37)
.549 (13.95)
.051 (1.30)
.049 (1.24)
PIN 1
.037 (0.94)
.026 (0.66)
.100 (2.54) TYP.
.183 (4.65)
.170 (4.32)
3° - 7°
(5x)
.026 (0.66)
.014 (0.36)
.055 (1.40)
.045 (1.14)
.010 (0.25)
.000 (0.00)
.110 (2.79)
.068 (1.72)
8° MAX.
Dimensions: inches (mm)
DS21373C-page 8
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