TC1272A Datasheet, PDF (7/14 Pages) Microchip Technology – 3-Pin Reset Monitor

TC1272A
3-Lead Plastic Small Outline Transistor (NB) (SOT-23)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
2
B
n
p1 _D
p
1

c
A
A2

A1

L
Units
Dimension Limits
Number of Pins
n
Pitch
p
Outside lead pitch (basic)
p1
Overall Height
A
Molded Package Thickness
A2
Standoff §
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Foot Length
L
Foot Angle

Lead Thickness
c
Lead Width
B
Mold Draft Angle Top

Mold Draft Angle Bottom

* Controlling Parameter
§ Significant Characteristic
MIN
.035
.035
.000
.083
.047
.110
.014
0
.004
.015
0
0
INCHES*
NOM
3
.038
.076
.040
.037
.002
.093
.051
.115
.018
5
.006
.017
5
5
MAX
.044
.040
.004
.104
.055
.120
.022
10
.007
.020
10
10
MILLIMETERS
MIN
NOM
3
0.96
1.92
0.89
1.01
0.88
0.95
0.01
0.06
2.10
2.37
1.20
1.30
2.80
2.92
0.35
0.45
0
5
0.09
0.14
0.37
0.44
0
5
0
5
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
MAX
1.12
1.02
0.10
2.64
1.40
3.04
0.55
10
0.18
0.51
10
10
 2004-2012 Microchip Technology Inc.
DS21877B-page 7