TC1173 Datasheet, PDF (7/12 Pages) TelCom Semiconductor, Inc – 300mA CMOS LDO with Shutdown, ERROR Output and Bypass

TC1173
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Package marking data not available at this time.
6.2 Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin MSOP
Carrier Width (W)
12 mm
Pitch (P)
8 mm
Part Per Full Reel
2500
Reel Size
13 in
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin SOIC (N)
Carrier Width (W)
12 mm
Pitch (P)
8 mm
Part Per Full Reel
2500
Reel Size
13 in
© 2002 Microchip Technology Inc.
DS21362B-page 7