USB5534B Datasheet, PDF (60/73 Pages) Microchip Technology – 4-Port SS/HS USB Hub Controller

USB5534B
6.5 Capacitance
TABLE 6-3: PIN CAPACITANCE
Limits
Parameter
Clock Input Capacitance
Symbol
C_XTAL
MIN TYP MAX Unit
2
pF
Input Capacitance
Output Capacitance
C_IN
C_OUT
5
pF
10
pF
Note 6-4 Capacitance T_A = 25°C; fc = 1 MHz; VDD33 = 3.3 V
Test Condition
All pins except USB pins and the pins
under the test tied to AC ground
6.5.1 PACKAGE THERMAL SPECIFICATIONS
Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal vias in a multi-
layer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the ambient air. The values provided are
based on the package body, die size, maximum power consumption, 70°C ambient temperature, and 125°C junction
temperature of the die.
Symbol
_JA
_JT
_JC
USB5534B
(°C/W)
23.0
0.1
1.4
VELOCITY
(Meter/s)
0
0
0
Use the following formulas to calculate the junction temperature:
TJ = P x JA + TA
TJ = P x JT + TT
TJ = P x JC + TC
Symbol
T_J
P
_JA
_JC
_JT
T_A
T_C
T_T
Description
Junction temperature
Power dissipated
Junction-to-ambient-temperature
Junction-to-top-of-package
Junction-to-bottom-of-case
Ambient temperature
Temperature of the bottom of the case
Temperature of the top of the case
DS00001681C-page 60
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