TC1047AVNBTR Datasheet, PDF (6/12 Pages) Microchip Technology – Precision Temperature-to-Voltage Converter

TC1047/TC1047A
3-Lead Plastic Small Outline Transistor (TT) (SOT-23)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
2
B
n
p1 _D
p
1
a
c
A
A2
f
A1
b
L
Units
Dimension Limits
Number of Pins
n
Pitch
p
Outside lead pitch (basic)
p1
Overall Height
A
Molded Package Thickness
A2
Standoff
A1
MIN
.035
.035
.000
INCHES*
NOM
3
.038
.076
.040
.037
.002
MAX
.044
.040
.004
MILLIMETERS
MIN
NOM
3
0.96
1.92
0.89
1.01
0.88
0.95
0.01
0.06
MAX
1.12
1.02
0.10
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
E
.083
.093
.104
2.10
2.37
2.64
E1
.047
.051
.055
1.20
1.30
1.40
D
.110
.115
.120
2.80
2.92
3.04
L
.014
.018
.022
0.35
0.45
0.55
f
0
5
10
0
5
10
c
.004
.006
.007
0.09
0.14
0.18
B
.015
.017
.020
0.37
0.44
0.51
a
0
5
10
0
5
10
b
0
5
10
0
5
10
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .005" (0.127mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
Revised 03-11-05
DS21498D-page 6
 2001-2012 Microchip Technology Inc.