MCP6S21 Datasheet, PDF (5/43 Pages) Microchip Technology – Single-Ended, Rail-to-Rail I/O, Low Gain PGA

MCP6S21/2/6/8
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, V_DD = +2.5V to +5.5V, V_SS = GND.
Parameters
Sym
Min
Typ Max Units
Conditions
Temperature Ranges
Specified Temperature Range
T_A
Operating Temperature Range
T_A
Storage Temperature Range
T_A
Thermal Package Resistances
-40
— +85 °C
-40
— +125 °C (Note Note:)
-65
— +150 °C
Thermal Resistance, 8L-PDIP
θ_JA
—
85
— °C/W
Thermal Resistance, 8L-SOIC
θ_JA
—
163
— °C/W
Thermal Resistance, 8L-MSOP
θ_JA
—
206
— °C/W
Thermal Resistance, 14L-PDIP
θ_JA
—
70
— °C/W
Thermal Resistance, 14L-SOIC
θ_JA
—
120
— °C/W
Thermal Resistance, 14L-TSSOP θ_JA
—
100
— °C/W
Thermal Resistance, 16L-PDIP
θ_JA
—
70
— °C/W
Thermal Resistance, 16L-SOIC
θ_JA
—
90
— °C/W
Note 1: The MCP6S21/2/6/8 family of PGAs operates over this extended temperature range, but with reduced
performance. Operation in this range must not cause T_J to exceed the Maximum Junction Temperature
(150°C).
CS
t_CH
CS
t_G
V_OUT
FIGURE 1-1:
Diagram.
0.6V
0.3V
Channel Select Timing
CS
t_ON
t_OFF
V_OUT
FIGURE 1-3:
Diagram.
1.5V
0.3V
Gain Select Timing
V_{DD VPOR - 0.1V}
V_POR + 0.1V
t_RPU
V_POR - 0.1V
t_RPD
V_OUT
Hi-Z
0.3V
Hi-Z
I_SS
500 nA (typ)
1.0 mA (typ)
FIGURE 1-2:
PGA Shutdown timing
diagram (must enter correct commands before
CS goes high).
V_OUT
I_SS
Hi-Z
Hi-Z
0.3V
500 nA (typ)
1.0 mA (typ)
FIGURE 1-4:
POR power-up and power-
down timing diagram.
 2003 Microchip Technology Inc.
DS21117A-page 5