MCP9902 Datasheet, PDF (41/50 Pages) Microchip Technology – Multi-Channel Low-Temperature Remote Diode Sensor

MCP9902/3/4
8-Lead Very, Very Thin Plastic Dual Flat, No Lead Package (RW) - 2x2 mm Body [WDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
X1
G
Y1
C
2X CH
ØV
8
E
X2
(G2)
SILK SCREEN
Y2
RECOMMENDED LAND PATTERN
Notes:
Units
Dimension Limits
Contact Pitch
E
Optional Center Pad Width
Y2
Optional Center Pad Length
X2
Contact Pad Spacing
C
Center Pad Chamfer
CH
Contact Pad Width (X8)
X1
Contact Pad Length (X8)
Y1
Contact Pad to Contact Pad (X6) G1
Contact Pad to Center Pad (X8)
G1
Thermal Via Diameter
V
MILLIMETERS
MIN
NOM
MAX
0.50 BSC
0.90
1.30
2.10
0.28
0.30
0.70
0.20
0.25 REF
0.30
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerances, for reference only.
Microchip Technology Drawing C04-2261A
 2015-2016 Microchip Technology Inc.
DS20005382C-page 41