TC3400 Datasheet, PDF (4/16 Pages) Microchip Technology – +1.8V, Low Power, 16-Bit Sigma-Delta A/D Converter

TC3400
TC3400 DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: T_A = 25°C and V_DD = 2.7V, unless otherwise specified. Boldface type specifications apply for
temperatures of 0°C to 85°C. V_REF = 1.25V, Internal Clock Frequency = 520kHz.
Symbol
Parameter
Min
Typ
Max
Unit
Test Conditions
SCLK
V_IL
V_IH
I_LEAK
SDAT
Input Low Voltage
Input High Voltage
Leakage Current
—
—
0.7 x V_DD
—
—
1
V_OL
Output Low Voltage
—
—
V_OH
Output High Voltage (SDAT)
0.9 x V_DD
—
Note 1: Differential input voltage defined as (V_IN+ – V_IN-).
2: Resistance from INn+ to INn- or INn to GND.
3: @ V_DD = 1.8V, I_SOURCE ≤ 200µA.
0.3 x V_DD
V
—
V
—
µA
0.4
V I_OL = 1.5mA
—
V I_SOURCE = 400µA (Note 3)
TC3400 AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: T_A = 25°C and V_DD = 2.7V, unless otherwise specified. Boldface type specifications apply for
temperatures of 0°C to 85°C. V_REF = 1.25V, Internal Clock Frequency = 520kHz.
Symbol
Parameter
Min
Typ
Max Unit
Test Conditions
t₁
Resolution Reduction Clock Width
1
—
—
µsec Width of SCLK (Negative)
t₂
Resolution Reduction Clock Width
1
—
—
µsec Width of SCLK (Positive)
t₃
Conversion Time (15-bit Plus Sign) —
125
—
msec 16-bit Conversion, T_A = 25°C (Note 1)
Conversion Time (14-bit Plus Sign) —
t₃/2.0
—
msec 15-bit Conversion
Conversion Time (13-bit Plus Sign) —
t₃/4.0
—
msec 14-bit Conversion
Conversion Time (12-bit Plus Sign) —
t₃/7.8
—
msec 13-bit Conversion
Conversion Time (11-bit Plus Sign) —
t₃/15.1
—
msec 12-bit Conversion
Conversion Time (10-bit Plus Sign) —
t₃/28.6
—
msec 11-bit Conversion
Conversion Time (9-bit Plus Sign)
—
t₃/51.4
—
msec 10-bit Conversion
t₄
Resolution Reduction Window
—
t₃/85.7
—
msec Width of SCLK
t₅
SCLK to Data Valid
1000
—
—
nsec SCLK Falling Edge to SDAT Valid
t₈
Acknowledge Delay
—
—
1000 nsec SCLK to SDAT Delay
Note 1: Nominal temperature drift is -2830ppm/C° for temperature less than 25°C and -1340ppm/°C for temperatures
greater than 25°C.
DS21409B-page 4
© 2002 Microchip Technology Inc.