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MCP1602 Datasheet, PDF (4/26 Pages) Microchip Technology – 2.0 MHz, 500 mA Synchronous Buck Regulator with Power-Good
MCP1602
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VIN - AGND ......................................................................+6.0V
All Other I/O .............................. (AGND - 0.3V) to (VIN + 0.3V)
LX to PGND ............................................. -0.3V to (VIN + 0.3V)
Output Short Circuit Current..................................Continuous
Power Dissipation (Note 6) ..........................Internally Limited
Storage Temperature.................................... -65oC to +150oC
Ambient Temp. with Power Applied................ -40oC to +85oC
Operating Junction Temperature.................. -40oC to +125oC
ESD Protection On All Pins:
HBM..............................................................................3 kV
MM...............................................................................200V
DC CHARACTERISTICS
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational sections of this specification is not intended.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Electrical Characteristics: Unless otherwise indicated, VIN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH,
VOUT(ADJ) = 1.8V, IOUT = 100 mA, TA = +25°C. Boldface specifications apply for the TA range of -40oC to +85oC.
Parameters
Sym Min Typ Max Units
Conditions
Input Characteristics
Input Voltage
VIN
2.7 — 5.5
Maximum Output Current
IOUT
500 —
—
Shutdown Current
IIN_SHDN —
0.05
1
Quiescent Current
IQ
—
45
60
Shutdown/UVLO/Thermal Shutdown Characteristics
V Note 1
mA Note 1
µA SHDN = GND
µA SHDN = VIN, IOUT = 0 mA
SHDN, Logic Input Voltage Low
VIL
—
SHDN, Logic Input Voltage High VIH
45
SHDN, Input Leakage Current VL_SHND -1.0
Undervoltage Lockout
UVLO 2.40
Undervoltage Lockout Hystere- UVLOHYS —
sis
—
—
±0.1
2.55
200
15
—
1.0
2.70
—
%VIN
%VIN
µA
V
mV
VIN = 2.7V to 5.5V
VIN = 2.7V to 5.5V
VIN = 2.7V to 5.5V, SHDN = AGND
VIN Falling
Thermal Shutdown
TSHD
— 150 —
Thermal Shutdown Hysteresis TSHD-HYS —
10
—
Output Characteristics
°C Note 5, Note 6
°C Note 5, Note 6
Adjustable Output Voltage
Range
VOUT
0.8
—
4.5
V Note 2
Reference Feedback Voltage
VFB
— 0.8 —
V
Feedback Input Bias Current
IVFB
— -1.5 —
nA
Note 1: The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VOUT + 0.5V.
2: Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.
3: VR is the output voltage setting.
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load
regulation is tested over a load range of 0.1 mA to the maximum specified output current. Changes in
output voltage due to heating effects are covered by the thermal regulation specification.
5: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
temperature and the thermal resistance from junction to air (i.e. TA, TJ, θJA). Exceeding the maximum
allowable power dissipation causes the device to initiate thermal shutdown.
6: The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin
to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits
must be adhered too. Thermal protection is not able to limit the junction temperature for these cases.
7: The current limit threshold is a cycle-by-cycle current limit.
DS22061A-page 4
© 2007 Microchip Technology Inc.