MCP2200_15 Datasheet, PDF (34/44 Pages) Microchip Technology – USB 2.0 to UART Protocol Converter with GPIO

MCP2200
20-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x1.0 mm Body [VQFN]
With 0.40 mm Contact Length
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X2
EV
20
1
Y2
2
C2 _EV
ØV
G
Y1
E
X1
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Optional Center Pad Width
W2
Optional Center Pad Length
T2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X20)
X1
Contact Pad Length (X20)
Y1
Distance Between Pads
G
Thermal Via Diameter
V
Thermal Via Pitch
EV
MILLIMETERS
MIN
NOM
MAX
0.65 BSC
3.35
3.35
4.50
4.50
0.40
0.55
0.20
0.30
1.00
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-2139B (MQ)
DS20002228C-page 34
 2011-2015 Microchip Technology Inc.